Inventor · disambiguated record
David Wei
Also filed as: WEI DAVID · WEI DAVID T
19 granted patents·1 pending application·265 citations·filing 1978–2008
95Inventor score
Top patents by PatentIndex Score
20 records- 0193US7307025B1Lag controlLAM RES CORP·Filed 2005·Granted Dec 11, 2007·26 cites·15 claims
- 0292US4142958AMethod for fabricating multi-layer optical filmsLITTON SYSTEMS INC·Filed 1978·Granted Mar 6, 1979·63 cites·9 claims
- 0391US7892445B1Wafer electrical discharge control using argon free dechucking gasLAM RES CORP·Filed 2007·Granted Feb 22, 2011·23 cites·20 claims
- 0481US6896586B2Method and apparatus for heating polishing padLAM RES CORP·Filed 2002·Granted May 24, 2005·26 cites·16 claims
- 0580US6984892B2Semiconductor structure implementing low-K dielectric materials and supporting stubsLAM RES CORP·Filed 2001·Granted Jan 10, 2006·23 cites·8 claims
- 0677US6190511B1Method and apparatus for ion beam sputter deposition of thin filmsFiled 1998·Granted Feb 20, 2001·47 cites·8 claims
- 0776US7425501B2Semiconductor structure implementing sacrificial material and methods for making and implementing the sameLAM RES CORP·Filed 2005·Granted Sep 16, 2008·5 cites·6 claims
- 0874US7789991B1Lag controlLAM RES CORP·Filed 2007·Granted Sep 7, 2010·4 cites·6 claims
- 0972US7297966B2Utilizing an integrated plasmon detector to measure a metal deposit roughness on a semiconductor surfaceCALIFORNIA INST OF TECHN·Filed 2005·Granted Nov 20, 2007·2 cites·9 claims
- 1069US6808442B1Apparatus for removal/remaining thickness profile manipulationLAM RES CORP·Filed 2001·Granted Oct 26, 2004·12 cites·22 claims
- 1168US6749491B1CMP belt stretch compensation apparatus and methods for using the sameLAM RES CORP·Filed 2001·Granted Jun 15, 2004·12 cites·16 claims
- 1261US7875548B2Method for making semiconductor structures implementing sacrificial materialLAM RES CORP·Filed 2008·Granted Jan 25, 2011·1 cites·12 claims
- 1358US7495230B2Using a polaron interaction zone as an interface to integrate a plasmon layer and a semiconductor detectorCALIFORNIA INST OF TECHN·Filed 2005·Granted Feb 24, 2009·2 cites·7 claims
- 1458US6719874B1Active retaining ring supportLAM RES CORP·Filed 2001·Granted Apr 13, 2004·7 cites·16 claims
- 1554US6656024B1Method and apparatus for reducing compressed dry air usage during chemical mechanical planarizationLAM RES CORP·Filed 2001·Granted Dec 2, 2003·5 cites·8 claims
- 1650US6976906B2Apparatus for reducing compressed dry air usage during chemical mechanical planarizationLAM RES CORP·Filed 2003·Granted Dec 20, 2005·3 cites·9 claims
- 1749US6761626B2Air platen for leading edge and trailing edge controlLAM RES CORP·Filed 2001·Granted Jul 13, 2004·3 cites·11 claims
- 1841US7018276B2Air platen for leading edge and trailing edge controlLAM RES CORP·Filed 2004·Granted Mar 28, 2006·0 cites·15 claims
- 1941US6878048B2CMP belt stretch compensation apparatus and methods for using the sameLAM RES CORP·Filed 2004·Granted Apr 12, 2005·1 cites·4 claims
- 2036US2002142601A1Method for planarizing a surface of a semiconductor wafer with a fixed abrasive materialFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →