Inventor · disambiguated record
Kiichi Kawabata
Also filed as: KAWABATA KIICHI
8 granted patents·31 citations·filing 2000–2019
80Inventor score
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8 records- 0180US8987358B2Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductorKAWABATA KIICHI·Filed 2012·Granted Mar 24, 2015·5 cites·10 claims
- 0279US6310169B1Polymerizable terminal group-containing polyorganosiloxane and production process for the sameCHISSO CORP·Filed 2000·Granted Oct 30, 2001·21 cites·4 claims
- 0375US9512273B2Thermosetting resin compositionJNC CORP·Filed 2013·Granted Dec 6, 2016·1 cites·11 claims
- 0469US9593240B2Thermosetting resin compositionJNC CORP·Filed 2013·Granted Mar 14, 2017·2 cites·14 claims
- 0568US9115243B2Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductorJNC CORP·Filed 2014·Granted Aug 25, 2015·1 cites·9 claims
- 0651US8952108B2Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductorINOKI DAISUKE·Filed 2010·Granted Feb 10, 2015·1 cites·14 claims
- 0735US12384888B2Condensation-curable resin composition, cured product, molded body, and semiconductor deviceJNC CORP·Filed 2019·Granted Aug 12, 2025·0 cites·14 claims
- 0835US8946357B2Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductorKAWABATA KIICHI·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
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