Inventor · disambiguated record
Wen-Chin Lai
Also filed as: LAI WEN-CHIN
2 granted patents·1 pending application·2 citations·filing 2014–2017
34Inventor score
Top patents by PatentIndex Score
3 records- 0160US10406666B2Stapler with a damping devicePAO SHEN ENTPR CO LTD·Filed 2017·Granted Sep 10, 2019·2 cites·8 claims
- 0236US2014353014A1Combined circuit board and method of manufacturing the sameMUTUAL TEK IND CO LTD·Filed 2014·Application pending·0 cites
- 0321US9526179B2Printed circuit board and method thereofMUTUAL-TEK IND CO LTD·Filed 2015·Granted Dec 20, 2016·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →