Inventor · disambiguated record

Ke Jung Jen

Also filed as: JEN KE JUNG

1 granted patent·5 citations·filing 2011–2011

26Inventor score

Technology areasH10P

Files withCHEN JEN YU1

Top patents by PatentIndex Score

1 record

0173US9685402B2Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrateCHEN JEN YU·Filed 2011·Granted Jun 20, 2017·5 cites·24 claims

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