Inventor · disambiguated record
Richard Strode
Also filed as: STRODE RICHARD
2 granted patents·4 citations·filing 2009–2013
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0162US9374902B2Package including an underfill material in a portion of an area between the package and a substrate or another packageMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 21, 2016·2 cites·29 claims
- 0256US8451620B2Package including an underfill material in a portion of an area between the package and a substrate or another packageYIM MYUNG JIN·Filed 2009·Granted May 28, 2013·2 cites·32 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →