Inventor · disambiguated record
Nanette Quevedo
Also filed as: QUEVEDO NANETTE
2 granted patents·1 pending application·4 citations·filing 2008–2013
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0162US9374902B2Package including an underfill material in a portion of an area between the package and a substrate or another packageMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 21, 2016·2 cites·29 claims
- 0256US8451620B2Package including an underfill material in a portion of an area between the package and a substrate or another packageYIM MYUNG JIN·Filed 2009·Granted May 28, 2013·2 cites·32 claims
- 0339US2010148359A1Package on Package Assembly using Electrically Conductive Adhesive MaterialQUEVEDO NANETTE·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →