Inventor · disambiguated record
Hsin-Chieh Huang
Also filed as: HUANG HSIN W · HUANG HSIN-CHIEH
109 granted patents·18 pending applications·626 citations·filing 1993–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD76TAIWAN SEMICONDUCTOR MFG12HUANG HSIN-CHIEH10CHUN KUANG OPTICS CORP9TSMC SOLID STATE LIGHTING LTD9
Top patents by PatentIndex Score
127 records- 0198US9837359B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·43 cites·6 claims
- 0297US9922896B1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·18 cites·20 claims
- 0397US9905467B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 27, 2018·19 cites·20 claims
- 0497US9722050B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·14 cites·20 claims
- 0596US10032873B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·10 cites·20 claims
- 0695US9922895B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·8 cites·20 claims
- 0794US8624505B2Light color and intensity adjustable LEDHUANG HSIN-CHIEH·Filed 2010·Granted Jan 7, 2014·23 cites·20 claims
- 0894US8476918B2Apparatus and method for wafer level classification of light emitting deviceHUANG HSIN-CHIEH·Filed 2010·Granted Jul 2, 2013·14 cites·20 claims
- 0993US10290530B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·6 cites·20 claims
- 1093US10276506B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·7 cites·20 claims
- 1193US9153739B2Light emitting devices with textured active layerTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Oct 6, 2015·6 cites·19 claims
- 1292US11322419B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 1392US10163717B2Method of forming FinFET device by adjusting etch selectivity of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·5 cites·20 claims
- 1491US11362037B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·20 claims
- 1591US9029175B2Single phosphor layer photonic device for generating white light or color lightsTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted May 12, 2015·10 cites·20 claims
- 1690US11316030B2Fin field-effect transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 1790US10529697B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·5 cites·19 claims
- 1890US10505001B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·4 cites·20 claims
- 1990US8604498B2Single phosphor layer photonic device for generating white light or color lightsHUANG HSIN-CHIEH·Filed 2010·Granted Dec 10, 2013·11 cites·19 claims
- 2089US11749724B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·1 cites·20 claims
- 2189US11616133B2Fin field-effect transistor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 28, 2023·1 cites·20 claims
- 2288US10770402B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·3 cites·20 claims
- 2388US10247392B2Luminous systemCHUN KUANG OPTICS CORP·Filed 2015·Granted Apr 2, 2019·12 cites·9 claims
- 2488US10163745B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·3 cites·20 claims
- 2588US10128182B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 2688US8673666B2Light-emitting devices with textured active layerTSMC SOLID STATE LIGHTING LTD·Filed 2012·Granted Mar 18, 2014·4 cites·20 claims
- 2787US10692809B2Manufacturing method for semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 2887US10037961B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·6 cites·20 claims
- 2987US9647122B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 9, 2017·4 cites·20 claims
- 3086US10109589B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·3 cites·20 claims
- 3186US9711463B2Dicing method for power transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·20 claims
- 3286US8981397B2Light-emitting devices on textured substratesHUANG HSIN-CHIEH·Filed 2010·Granted Mar 17, 2015·4 cites·22 claims
- 3386US2025279325A1Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3485US10998235B2FinFET with sloped surface at interface between isolation structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·1 cites·20 claims
- 3585US10164071B2FinFET device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·3 cites·20 claims
- 3685US8523407B2Optical element and illuminant device using the sameHUANG HSIN-CHIEH·Filed 2011·Granted Sep 3, 2013·12 cites·13 claims
- 3784US10468504B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 3884US7068448B2Optical lens and lens systemAXON TECHNOLOGIES CORP·Filed 2004·Granted Jun 27, 2006·26 cites·18 claims
- 3983US12261074B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4083US10164072B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 4183US9125272B2Light color and intensity adjustable LEDTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Sep 1, 2015·5 cites·20 claims
- 4282US9933388B2Integrated biosensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·3 cites·20 claims
- 4382USD771172SLensCHUN KUANG OPTICS CORP·Filed 2015·Granted Nov 8, 2016·29 cites·1 claims
- 4482US8363848B2Method, computer readable storage medium and system for localizing acoustic sourceTECO ELECTRONIC & MACHINERY CO LTD·Filed 2010·Granted Jan 29, 2013·11 cites·16 claims
- 4582US2025201617A1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4680US11901303B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4780US10727135B2FinFET with sloped surface at interface between isolation structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·1 cites·20 claims
- 4880US5454871ASOG coated apparatus to solve SOG non-uniformity in the VLSI processTAIWAN SEMICONDUCTOR MFG·Filed 1994·Granted Oct 3, 1995·65 cites·3 claims
- 4979US11854993B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 5079US10964801B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
Showing the top 50 of 127 patent records by PatentIndex Score.
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