Inventor · disambiguated record
Rueyway Lin
Also filed as: LIN RUEYWAY
2 granted patents·1 pending application·58 citations·filing 1998–2002
66Inventor score
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
3 records- 0160US6002179ABonding pad structure for integrated circuit (I)WINBOND ELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·30 cites·22 claims
- 0256US5962919ABonding pad structure for integrated circuit (III)WINBOND ELECTRONICS CORP·Filed 1998·Granted Oct 5, 1999·28 cites·16 claims
- 0331US2004124865A1Method and structure for wafer-level reliability electromigration and stress migration test by isothermal heaterFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →