Inventor · disambiguated record
Kwan-Yu Lai
Also filed as: LAI KWAN-YU
20 granted patents·13 pending applications·466 citations·filing 2012–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0198US9633974B2System in package fan out stacking architecture and process flowAPPLE INC·Filed 2015·Granted Apr 25, 2017·57 cites·16 claims
- 0298US9559081B1Independent 3D stackingAPPLE INC·Filed 2015·Granted Jan 31, 2017·268 cites·19 claims
- 0397US9679801B2Dual molded stack TSV packageAPPLE INC·Filed 2015·Granted Jun 13, 2017·25 cites·17 claims
- 0497US9263370B2Semiconductor device with via barQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·58 cites·26 claims
- 0596US11881678B1Photonics assembly with a photonics die stackAPPLE INC·Filed 2020·Granted Jan 23, 2024·9 cites·20 claims
- 0693US10115671B2Incorporation of passives and fine pitch through via for package on packageQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Oct 30, 2018·16 cites·34 claims
- 0791US11158607B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2019·Granted Oct 26, 2021·4 cites·19 claims
- 0890US11735567B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2021·Granted Aug 22, 2023·1 cites·22 claims
- 0990US10102962B1Integrated magnetic passive devices using magnetic filmAPPLE INC·Filed 2016·Granted Oct 16, 2018·7 cites·13 claims
- 1089US9899239B2Carrier ultra thin substrateAPPLE INC·Filed 2015·Granted Feb 20, 2018·6 cites·17 claims
- 1186US9679187B2Finger biometric sensor assembly including direct bonding interface and related methodsAPPLE INC·Filed 2015·Granted Jun 13, 2017·5 cites·26 claims
- 1283US12322730B2Wafer reconstitution and die-stitchingAPPLE INC·Filed 2023·Granted Jun 3, 2025·0 cites·13 claims
- 1382US9325420B2Electro-optical transceiver device to enable chip-to-chip interconnectionQUALCOMM INC·Filed 2014·Granted Apr 26, 2016·5 cites·30 claims
- 1477US2025157991A1Wafer reconstitution and die-stitchingAPPLE INC·Filed 2025·Application pending·0 cites
- 1571US11056373B23D fanout stackingAPPLE INC·Filed 2015·Granted Jul 6, 2021·2 cites·17 claims
- 1671US9190208B2Metal-insulator-metal capacitors on glass substratesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Nov 17, 2015·2 cites·28 claims
- 1764US9293245B2Integration of a coil and a discontinuous magnetic coreQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Mar 22, 2016·1 cites·42 claims
- 1863US2025253255A1Unitized Finger to Bump Interposer PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 1963US2019051449A1Integrated magnetic passive devices using magnetic filmAPPLE INC·Filed 2018·Application pending·0 cites
- 2061US2025329673A1Direct Wire Reveal PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 2155US9548350B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2014·Granted Jan 17, 2017·0 cites·9 claims
- 2255US2014104288A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2354US2023245988A1Harvested Reconstitution BumpingAPPLE INC·Filed 2022·Application pending·0 cites
- 2453US9773862B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2016·Granted Sep 26, 2017·0 cites·14 claims
- 2551US2014144681A1Adhesive metal nitride on glass and related methodsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2650US2018082858A1Carrier ultra thin substrateAPPLE INC·Filed 2017·Application pending·0 cites
- 2750US2014104284A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2845US9510454B2Integrated interposer with embedded active devicesQUALCOMM INC·Filed 2014·Granted Nov 29, 2016·0 cites·16 claims
- 2945US2015311271A1Landside embedded inductor for fanout packagingQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3045US2014177188A1Laser encapsulation of multiple dissimilar devices on a substrateQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 3142US10199152B2Embedded thin film magnetic carrier for integrated voltage regulatorQUALCOMM INC·Filed 2015·Granted Feb 5, 2019·0 cites·12 claims
- 3238US2014035935A1Passives via barSHENOY RAVINDRA V·Filed 2012·Application pending·0 cites
- 3333US2016315024A1Mechanical handling support for thin cores using photo-patternable materialQUALCOMM INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →