Inventor · disambiguated record
Sa-Lly Liu
Also filed as: LIU SA · LIU SA-LLY
22 granted patents·3 pending applications·224 citations·filing 1998–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11SEIKO EPSON CORP3UNIV SOUTH CHINA TECH3CHENGDU BOE OPTOELECT TECH CO2YANG PING-LIN2
Top patents by PatentIndex Score
25 records- 0192US6310637B1Method of printing test pattern and printing apparatus for the sameSEIKO EPSON CORP·Filed 1998·Granted Oct 30, 2001·92 cites·19 claims
- 0286US8760255B2Contactless communications using ferromagnetic materialYANG PING-LIN·Filed 2011·Granted Jun 24, 2014·8 cites·21 claims
- 0386US8513795B23D IC configuration with contactless communicationYANG PING-LIN·Filed 2011·Granted Aug 20, 2013·9 cites·16 claims
- 0480US10510637B2Devices and methods for heat dissipation of semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·24 claims
- 0580US6341833B1Print control apparatus, printing apparatus, print control method, printing method, recording medium, and method for setting up color conversion tableSEIKO EPSON CORP·Filed 2000·Granted Jan 29, 2002·21 cites·16 claims
- 0679US6293643B1Printing apparatus, printing method, and recording mediumSEIKO EPSON CORP·Filed 1998·Granted Sep 25, 2001·69 cites·9 claims
- 0778US9899982B2On-chip electromagnetic bandgap (EBG) structure for noise suppressionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·3 cites·20 claims
- 0878US8856710B2Tool and method for modeling interposer RC couplingsYEH CHAO-YANG·Filed 2011·Granted Oct 7, 2014·8 cites·20 claims
- 0977US9548267B2Three dimensional circuit including shielded inductor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 17, 2017·2 cites·20 claims
- 1076US10889898B2Method for improving blood compatibility of material surface by using controllable grafting techniqueUNIV SOUTH CHINA TECH·Filed 2016·Granted Jan 12, 2021·1 cites·10 claims
- 1173US10289777B2Integrated circuit designs based on temperature distribution determinationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 14, 2019·3 cites·20 claims
- 1272US9103884B2De-embedding on-wafer devicesYEN HSIAO-TSUNG·Filed 2010·Granted Aug 11, 2015·2 cites·15 claims
- 1371US9412721B2Contactless communications using ferromagnetic materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 9, 2016·2 cites·20 claims
- 1468US12297300B2Hyaluronic acid-based zwitterionic polymer brush, preparation method thereof, and use thereofUNIV SOUTH CHINA TECH·Filed 2018·Granted May 13, 2025·0 cites·5 claims
- 1568US9658275B2De-embedding on-wafer devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·1 cites·18 claims
- 1664US2021125890A1Devices and methods for heat dissipation of semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 1763US10886190B2Devices and methods for heat dissipation of semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1862US9355960B2Electromagnetic bandgap structure for three dimensional ICSTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 31, 2016·1 cites·20 claims
- 1959US12477932B2Display substrate and preparation method thereof, and display apparatus each including partition region provides with at least one partition dam surrounding function holeCHENGDU BOE OPTOELECT TECH CO·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 2058US10758889B2Medical macromolecular microsphere adsorbent for a blood perfusion apparatus and a preparation method thereofUNIV SOUTH CHINA TECH·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 2157US2025009126A1WorkstationSTEELCASE INC·Filed 2024·Application pending·0 cites
- 2255US9048127B2Three dimensional circuit including shielded inductor and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·0 cites·19 claims
- 2351US8921160B23D IC configuration with contactless communicationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 30, 2014·0 cites·20 claims
- 2445US2024306428A1Display Substrate, Manufacturing Method Thereof and Display DeviceCHENGDU BOE OPTOELECT TECH CO·Filed 2022·Application pending·0 cites
- 2539US10027304B2Dual-band band-pass filters and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 17, 2018·0 cites·20 claims
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