Inventor · disambiguated record
Robert Francis Darveaux
Also filed as: DARVEAUX ROBERT · DARVEAUX ROBERT F · DARVEAUX ROBERT FRANCIS
81 granted patents·15 pending applications·2,559 citations·filing 1991–2024
99Inventor score
Files withSKYWORKS SOLUTIONS INC37AMKOR TECHNOLOGY INC35DARVEAUX ROBERT FRANCIS6AMKOR TECH SINGAPORE HOLDING PTE LTD5MOTOROLA INC5
Top patents by PatentIndex Score
96 records- 0199US7932170B1Flip chip bump structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 26, 2011·197 cites·16 claims
- 0297US7898093B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 1, 2011·50 cites·8 claims
- 0397US6201305B1Making solder ball mounting pads on substratesAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 13, 2001·245 cites·18 claims
- 0496US8653674B1Electronic component package fabrication method and structureDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Feb 18, 2014·28 cites·20 claims
- 0596US8482134B1Stackable package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Jul 9, 2013·30 cites·4 claims
- 0695US11961805B2Devices and methods related to dual-sided radio-frequency package with overmold structureSKYWORKS SOLUTIONS INC·Filed 2021·Granted Apr 16, 2024·2 cites·18 claims
- 0795US11894323B2Devices related to dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0895US8476748B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jul 2, 2013·15 cites·20 claims
- 0995US7576401B1Direct glass attached on die optical moduleAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 18, 2009·58 cites·20 claims
- 1095US7253503B1Integrated circuit device packages and substrates for making the packagesAMKOR TECHNOLOGY INC·Filed 2004·Granted Aug 7, 2007·120 cites·19 claims
- 1195US5859475ACarrier strip and molded flex circuit ball grid arrayAMKOR TECHNOLOGY INC·Filed 1996·Granted Jan 12, 1999·166 cites·4 claims
- 1295US5325265AHigh performance integrated circuit chip packageMCNC·Filed 1992·Granted Jun 28, 1994·252 cites·29 claims
- 1394US11974390B2Reduction of packaging substrate deformationSKYWORKS SOLUTIONS INC·Filed 2023·Granted Apr 30, 2024·2 cites·18 claims
- 1494US10497656B2Dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 3, 2019·8 cites·16 claims
- 1594US10410885B2Control of under-fill using under-fill deflash for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Sep 10, 2019·6 cites·16 claims
- 1694US9462690B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 4, 2016·15 cites·20 claims
- 1794US9419667B2Apparatus and methods related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2014·Granted Aug 16, 2016·15 cites·20 claims
- 1894US8536462B1Flex circuit package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Sep 17, 2013·41 cites·20 claims
- 1994US8536458B1Fine pitch copper pillar package and methodDARVEAUX ROBERT FRANCIS·Filed 2009·Granted Sep 17, 2013·27 cites·18 claims
- 2094US8129824B1Shielding for a semiconductor packageST AMAND ROGER D·Filed 2008·Granted Mar 6, 2012·54 cites·21 claims
- 2194US8017436B1Thin substrate fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 13, 2011·33 cites·23 claims
- 2294US5985695AMethod of making a molded flex circuit ball grid arrayAMKOR TECHNOLOGY INC·Filed 1998·Granted Nov 16, 1999·134 cites·26 claims
- 2393US11244835B2Control of under-fill using a film during fabrication for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2020·Granted Feb 8, 2022·2 cites·20 claims
- 2493US10347562B1Methods and structures for increasing the allowable die size in TMV packagesAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 2593US8300423B1Stackable treated via package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Oct 30, 2012·18 cites·19 claims
- 2693US7911017B1Direct glass attached on die optical moduleAMKOR TECHNOLOGY INC·Filed 2009·Granted Mar 22, 2011·33 cites·18 claims
- 2792US11139257B2Methods related to dual-sided module with land-grid array (LGA) footprintSKYWORKS SOLUTIONS INC·Filed 2019·Granted Oct 5, 2021·5 cites·15 claims
- 2892US10980106B2Apparatus related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2019·Granted Apr 13, 2021·5 cites·13 claims
- 2992US10524350B2Apparatus and methods related to conformal coating implemented with surface mount devicesSKYWORKS SOLUTIONS INC·Filed 2016·Granted Dec 31, 2019·6 cites·17 claims
- 3092US10460957B2Control of under-fill using an encapsulant for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Oct 29, 2019·4 cites·20 claims
- 3192US8847372B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
- 3292US7126218B1Embedded heat spreader ball grid arrayAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 24, 2006·108 cites·48 claims
- 3392US6400033B1Reinforcing solder connections of electronic devicesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·58 cites·26 claims
- 3492US6331451B1Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·95 cites·36 claims
- 3592US6124637ACarrier strip and molded flex circuit ball grid array and method of makingAMKOR TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·107 cites·23 claims
- 3692US5203076AVacuum infiltration of underfill material for flip-chip devicesMOTOROLA INC·Filed 1991·Granted Apr 20, 1993·170 cites·10 claims
- 3791US11233014B2Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the sameSKYWORKS SOLUTIONS INC·Filed 2018·Granted Jan 25, 2022·6 cites·8 claims
- 3891US9721872B1Methods and structures for increasing the allowable die size in TMV packagesNICHOLLS LOUIS W·Filed 2012·Granted Aug 1, 2017·16 cites·21 claims
- 3991US8368194B1Exposed die overmolded flip chip packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Feb 5, 2013·8 cites·17 claims
- 4091US6580159B1Integrated circuit device packages and substrates for making the packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jun 17, 2003·107 cites·41 claims
- 4190US8541260B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 24, 2013·7 cites·20 claims
- 4289US8383950B1Metal etch stop fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2011·Granted Feb 26, 2013·8 cites·18 claims
- 4388US10224270B1Fine pitch copper pillar package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 5, 2019·4 cites·22 claims
- 4488US6807218B1Laser module and optical subassemblyAMKOR TECHNOLOGY INC·Filed 2002·Granted Oct 19, 2004·26 cites·29 claims
- 4587US10607944B2Dual-sided radio-frequency package with overmold structureSKYWORKS SOLUTIONS INC·Filed 2017·Granted Mar 31, 2020·3 cites·17 claims
- 4687US10361145B2Through-mold openings for dual-sided packaged modules with ball grid arraysSKYWORKS SOLUTIONS INC·Filed 2018·Granted Jul 23, 2019·4 cites·20 claims
- 4787US8390116B1Flip chip bump structure and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Mar 5, 2013·7 cites·18 claims
- 4887US7923645B1Metal etch stop fabrication method and structureAMKOR TECHNOLOGY INC·Filed 2007·Granted Apr 12, 2011·13 cites·15 claims
- 4986US11201066B2Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Dec 14, 2021·2 cites·6 claims
- 5085US10593565B2Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array packageSKYWORKS SOLUTIONS INC·Filed 2018·Granted Mar 17, 2020·2 cites·10 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
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