Inventor · disambiguated record
Toshifumi Matsushima
Also filed as: MATSUSHIMA TOSHIFUMI
16 granted patents·1 pending application·72 citations·filing 2001–2019
88Inventor score
Files withMITSUI MINING & SMELTING CO9MITSUI MINING & SMELTING CO LTD5SATO TETSURO2MATSUNAGA TETSUHIRO1
Top patents by PatentIndex Score
17 records- 0191US6693793B2Double-sided copper clad laminate for capacitor layer formation and its manufacturing methodMITSUI MINING & SMELTING CO·Filed 2001·Granted Feb 17, 2004·50 cites·38 claims
- 0275US6905757B2Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminateMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 14, 2005·15 cites·9 claims
- 0369US8304091B2Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereofMATSUNAGA TETSUHIRO·Filed 2005·Granted Nov 6, 2012·1 cites·20 claims
- 0467US11166383B2Resin-clad copper foil, copper-clad laminated plate, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2016·Granted Nov 2, 2021·1 cites·10 claims
- 0567US8431224B2Resin composition for forming insulating layer of printed wiring boardSATO TETSURO·Filed 2008·Granted Apr 30, 2013·1 cites·8 claims
- 0658US10524360B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2018·Granted Dec 31, 2019·0 cites·11 claims
- 0757US11950376B2Copper-clad laminateMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·9 claims
- 0857US6831129B2Resin-coated copper foil, and printed wiring board using resin-coated copper foilMITSUI MINING & SMELTING CO·Filed 2002·Granted Dec 14, 2004·3 cites·16 claims
- 0954US2010068511A1Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layerMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 1051US11419210B2Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2013·Granted Aug 16, 2022·0 cites·11 claims
- 1151US10342143B2Production method for printed wiring board having dielectric layerMITSUI MINING & SMELTING CO·Filed 2016·Granted Jul 2, 2019·0 cites·20 claims
- 1251US9924597B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 20, 2018·0 cites·4 claims
- 1348US11310910B2Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·10 claims
- 1446US10863621B2Metal foil with releasing resin layer, and printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Dec 8, 2020·0 cites·14 claims
- 1545US12297354B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted May 13, 2025·0 cites·14 claims
- 1643US8815387B2Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layerSATO TETSURO·Filed 2004·Granted Aug 26, 2014·1 cites·15 claims
- 1734US10244640B2Copper clad laminate provided with protective layer and multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 26, 2019·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →