Inventor · disambiguated record
Lawrence H. White
Also filed as: WHITE LAWRENCE · WHITE LAWRENCE H · WHITE LAWRENCE HAROLD
52 granted patents·5 pending applications·1,417 citations·filing 1975–2020
98Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO31HEWLETT PACKARD CO5IBM5MARDILOVICH PETER4WHITE LAWRENCE H3
Top patents by PatentIndex Score
57 records- 0199US6543879B1Inkjet printhead assembly having very high nozzle packing densityHEWLETT PACKARD CO·Filed 2001·Granted Apr 8, 2003·414 cites·52 claims
- 0299US6341845B1Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead diesHEWLETT PACKARD CO·Filed 2000·Granted Jan 29, 2002·248 cites·42 claims
- 0394US6464333B1Inkjet printhead assembly with hybrid carrier for printhead diesHEWLETT PACKARD CO·Filed 2000·Granted Oct 15, 2002·56 cites·40 claims
- 0493US9776402B2Thermal ink jet printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Oct 3, 2017·12 cites·20 claims
- 0591US5798285AMethod of making electronic module with multiple solder dams in soldermask windowINT BUSINESS MACHINES CORPOATI·Filed 1997·Granted Aug 25, 1998·154 cites·26 claims
- 0690US5729440ASolder hierarchy for chip attachment to substratesIBM·Filed 1997·Granted Mar 17, 1998·100 cites·5 claims
- 0790US5650595AElectronic module with multiple solder dams in soldermask windowIBM·Filed 1995·Granted Jul 22, 1997·120 cites·26 claims
- 0889US10112407B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Oct 30, 2018·3 cites·12 claims
- 0989US6561632B2Printhead with high nozzle packing densityHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted May 13, 2003·34 cites·18 claims
- 1088US5473814AProcess for surface mounting flip chip carrier modulesIBM·Filed 1994·Granted Dec 12, 1995·87 cites·42 claims
- 1183US8444255B2Power distribution in a thermal ink jet printheadBAKKER CHRIS·Filed 2011·Granted May 21, 2013·14 cites·19 claims
- 1283US6375307B1Printing apparatus and methodHEWLETT PACKARD CO·Filed 2000·Granted Apr 23, 2002·43 cites·19 claims
- 1382US10828908B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 10, 2020·1 cites·20 claims
- 1480US5535526AApparatus for surface mounting flip chip carrier modulesIBM·Filed 1995·Granted Jul 16, 1996·52 cites·15 claims
- 1578US7942997B2High resolution inkjet printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted May 17, 2011·9 cites·17 claims
- 1677US8991983B2Provide heat to end regions of a printhead dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Mar 31, 2015·2 cites·13 claims
- 1777US7377618B2High resolution inkjet printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 27, 2008·5 cites·23 claims
- 1874US11440331B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 1973US6554404B2Conductor routing for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 29, 2003·12 cites·7 claims
- 2073US6523940B2Carrier for fluid ejection deviceHEWLETT PACKARD CO·Filed 2001·Granted Feb 25, 2003·12 cites·40 claims
- 2172US10661564B2Ink jet printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted May 26, 2020·1 cites·19 claims
- 2271US11331918B2Ink jet printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted May 17, 2022·0 cites·14 claims
- 2371US10183496B2Ink jet printing with high drop weight (HDW) planes and low drop weight (LDW) planesHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Jan 22, 2019·1 cites·20 claims
- 2470US11186089B2Ink jet prinitheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 2570US10457048B2Ink jet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Oct 29, 2019·1 cites·19 claims
- 2669US10562304B2Noncircular inkjet nozzleHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
- 2769US2021046757A1Printhead with printer fluid check valveHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 2868US10780695B2Ink jet printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 2966US10252527B2Noncircular inkjet nozzleHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 9, 2019·0 cites·16 claims
- 3065US10112393B2Noncircular inkjet nozzleFEINN JAMES A·Filed 2010·Granted Oct 30, 2018·1 cites·18 claims
- 3165US3986301AApparatus for lapping the edges of a metal foil tapeSUNDSTRAND DATA CONTROL·Filed 1975·Granted Oct 19, 1976·14 cites·21 claims
- 3262US11230098B2Passivation stacksHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 25, 2022·0 cites·15 claims
- 3359US10828892B2Printhead with printer fluid check valveHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Nov 10, 2020·0 cites·20 claims
- 3459US10245832B2Ink jet printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Apr 2, 2019·0 cites·18 claims
- 3555US10493757B2Ink jet printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Dec 3, 2019·0 cites·20 claims
- 3653US8783831B2Fluid ejection device having firing chamber with contoured floorMARDILOVICH PETER·Filed 2012·Granted Jul 22, 2014·0 cites·15 claims
- 3753US8382255B2Thermal inkjet printhead with heating element in recessed substrate cavityHEWLETT PACKARD DEVELOPMENT CO·Filed 2009·Granted Feb 26, 2013·0 cites·8 claims
- 3852US6782621B2Method of fabricating a fluid ejectorHEWLETT PACKARD DEVELOPMENTAL·Filed 2003·Granted Aug 31, 2004·5 cites·13 claims
- 3951US10093096B2Maintenance of a printhead of a printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Oct 9, 2018·0 cites·20 claims
- 4051US9259932B2Assembly to selectively etch at inkjet printheadWHITE LAWRENCE H·Filed 2011·Granted Feb 16, 2016·1 cites·1 claims
- 4151US8944549B2Nozzle layouts for printheadsHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Feb 3, 2015·0 cites·12 claims
- 4251US8870351B2Heating resistorMARDILOVICH PETER·Filed 2011·Granted Oct 28, 2014·0 cites·15 claims
- 4350US7669314B2Method of fabricating a fluid ejection device having a data storage structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Mar 2, 2010·0 cites·9 claims
- 4450US5655703ASolder hierarchy for chip attachment to substratesIBM·Filed 1995·Granted Aug 12, 1997·14 cites·10 claims
- 4549US9931847B2Servicing a printhead of a printerHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Apr 3, 2018·0 cites·15 claims
- 4648US10562300B2Adaptive print head calibration processHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Feb 18, 2020·0 cites·15 claims
- 4748US10336070B2Fluid ejection device with a fluid recirculation channelHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jul 2, 2019·0 cites·20 claims
- 4848US8919928B2Fluid ejection device having firing chamber with mesaWHITE LAWRENCE H·Filed 2012·Granted Dec 30, 2014·0 cites·13 claims
- 4946US9570384B2Semiconductor deviceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
- 5045US8939552B2Thermal fluid-ejection echanism having heating resistor on cavity sidewallsMARDILOVICH PETER·Filed 2011·Granted Jan 27, 2015·0 cites·15 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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