Inventor · disambiguated record
Nobuyuki Iwano
Also filed as: IWANO NOBUYUKI
2 granted patents·3 pending applications·0 citations·filing 2010–2018
23Inventor score
Top patents by PatentIndex Score
5 records- 0156US2016280979A1Adhesive resin compositionARISAWA SEISAKUSHO KK·Filed 2016·Application pending·0 cites
- 0255US2013316170A1Resin Composition for Flexible Printed Circuit BoardARISAWA SEISAKUSHO KK·Filed 2013·Application pending·0 cites
- 0343US2018242448A1Resin composition, adhesive film, coverlay film, laminate, resin-coated copper foil and resin-coated copper-clad laminateARISAWA SEISAKUSHO KK·Filed 2018·Application pending·0 cites
- 0441US10982093B2Low-dielectric resin compositionARISAWA SEISAKUSHO KK·Filed 2016·Granted Apr 20, 2021·0 cites·17 claims
- 0537US8426503B2Composition for polyimide resin, and polyimide resin made of the composition for polyimide resinMATSUYAMA HIROYUKI·Filed 2010·Granted Apr 23, 2013·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →