Inventor · disambiguated record

Terunari Takano

Also filed as: TAKANO TERUNARI

4 granted patents·259 citations·filing 1996–2002

81Inventor score

Technology areasH10W

Files withTOSHIBA KK4

Top patents by PatentIndex Score

4 records

0194US6326243B1Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1997·Granted Dec 4, 2001·200 cites·12 claims
0269US6777313B2Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup timeTOSHIBA KK·Filed 2002·Granted Aug 17, 2004·17 cites·30 claims
0366US6545348B1Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chipTOSHIBA KK·Filed 2000·Granted Apr 8, 2003·17 cites·18 claims
0461US5753969AResin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1996·Granted May 19, 1998·25 cites·9 claims

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