Inventor · disambiguated record
Kazuhiro Hoshino
Also filed as: HOSHINO KAZUHIRO
38 granted patents·8 pending applications·720 citations·filing 1987–2025
98Inventor score
Files withSONY CORP15SONY SEMICONDUCTOR SOLUTIONS CORP9FURUKAWA ELECTRIC CO LTD5CANON KK3CIRCUIT FOIL JAPAN3
Top patents by PatentIndex Score
46 records- 0196US7175920B2Copper foil for high-density ultra-fine printed wiring boardCIRCUIT FOIL JAPAN·Filed 2005·Granted Feb 13, 2007·25 cites·17 claims
- 0295US4985750ASemiconductor device using copper metallizationFUJITSU LTD·Filed 1987·Granted Jan 15, 1991·137 cites·13 claims
- 0394US7825964B2Method of processing noise in image data, noise reduction unit, and imaging apparatusSONY CORP·Filed 2007·Granted Nov 2, 2010·20 cites·34 claims
- 0493US7026059B2Copper foil for high-density ultrafine printed wiring boadCIRCUIT FOIL JAPAN·Filed 2001·Granted Apr 11, 2006·36 cites·28 claims
- 0593US5315062AWire harness connector coverSUMITOMO WIRING SYSTEMS·Filed 1991·Granted May 24, 1994·87 cites·2 claims
- 0691US6759642B2Image pick-up device, camera module and camera systemSONY CORP·Filed 2001·Granted Jul 6, 2004·50 cites·5 claims
- 0790US10217034B2Image processing device, imaging device, and image processing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Granted Feb 26, 2019·8 cites·9 claims
- 0890US6858827B2Solid-state image pickup apparatus and control method thereofSONY CORP·Filed 2002·Granted Feb 22, 2005·35 cites·83 claims
- 0987US7579576B2Method of manufacturing a solid state image pickup apparatus having multiple transmission pathsSONY CORP·Filed 2005·Granted Aug 25, 2009·8 cites·72 claims
- 1086US7985485B2Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA ELECTRIC CO LTD·Filed 2009·Granted Jul 26, 2011·3 cites·7 claims
- 1185US7521656B2Solid-state image pickup apparatus and control method thereofSONY CORP·Filed 2005·Granted Apr 21, 2009·7 cites·20 claims
- 1283US7771841B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Aug 10, 2010·12 cites·6 claims
- 1383US7375757B1Imaging element, imaging device, camera module and camera systemSONY CORP·Filed 2000·Granted May 20, 2008·20 cites·15 claims
- 1482US4910169AMethod of producing semiconductor deviceFUJITSU LTD·Filed 1987·Granted Mar 20, 1990·57 cites·15 claims
- 1578US5444182AWire harness connector coverSUMITOMO WIRING SYSTEMS·Filed 1993·Granted Aug 22, 1995·35 cites·2 claims
- 1677US11514581B2Image capturing device, image capturing method, and image capturing systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Nov 29, 2022·2 cites·17 claims
- 1776US11346983B2Optical thin film and manufacturing method of optical elementCANON KK·Filed 2018·Granted May 31, 2022·3 cites·16 claims
- 1874US6395627B1Semiconductor device a burried wiring structure and process for fabricating the sameSONY CORP·Filed 2000·Granted May 28, 2002·17 cites·7 claims
- 1970US10885403B2Image processing device, imaging device, and image processing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jan 5, 2021·1 cites·13 claims
- 2070US5532600AMethod of and apparatus for evaluating reliability of metal interconnectSONY CORP·Filed 1994·Granted Jul 2, 1996·29 cites·18 claims
- 2169US11244209B2Image processing device, imaging device, and image processing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Feb 8, 2022·0 cites·19 claims
- 2268US7414663B2Imaging element, imaging device, camera module and camera systemSONY CORP·Filed 2004·Granted Aug 19, 2008·6 cites·24 claims
- 2367US11863911B2Imaging system, method of controlling imaging system, and object recognition systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Jan 2, 2024·1 cites·18 claims
- 2466US7985488B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2010·Granted Jul 26, 2011·2 cites·4 claims
- 2564US2025306248A1Optical element and apparatusCANON KK·Filed 2025·Application pending·0 cites
- 2662US5792333AMethod of surface-roughening treatment of copper foilCIRCUIT FOIL JAPAN·Filed 1997·Granted Aug 11, 1998·25 cites·21 claims
- 2761US12009375B2Imaging device and imaging elementSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Jun 11, 2024·0 cites·15 claims
- 2857US7892655B2Ultrathin copper foil with carrier and printed circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Feb 22, 2011·0 cites·6 claims
- 2957US5776830AProcess for fabricating connection structuresSONY CORP·Filed 1997·Granted Jul 7, 1998·22 cites·3 claims
- 3056US5972786AContact hole structure in a semiconductor and formation method thereforSONY CORP·Filed 1995·Granted Oct 26, 1999·21 cites·1 claims
- 3155US6114764ASemiconductor device and process for fabricating the sameSONY CORP·Filed 1996·Granted Sep 5, 2000·19 cites·6 claims
- 3250US2022373717A1Film, element, and equipmentCANON KK·Filed 2022·Application pending·0 cites
- 3348US9721699B2Water-stop structure for wire harnessSUMITOMO WIRING SYSTEMS·Filed 2014·Granted Aug 1, 2017·1 cites·1 claims
- 3447US2022309848A1Signal processing device, signal processing method, program, and imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Application pending·0 cites
- 3545US6111318ASemiconductor device comprising Cu--Ta and method for forming the semiconductor deviceSONY CORP·Filed 1998·Granted Aug 29, 2000·11 cites·8 claims
- 3645US5430258ACopper interconnection structure and method of preparing sameSONY CORP·Filed 1994·Granted Jul 4, 1995·13 cites·8 claims
- 3744US10863129B2Imaging apparatus and imaging apparatus control method to reduce power consumption without reduction of number of pixel signalsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Dec 8, 2020·0 cites·8 claims
- 3843US8149302B2Method of processing noise in image data, noise reduction unit, and imaging apparatusHOSHINO KAZUHIRO·Filed 2010·Granted Apr 3, 2012·0 cites·17 claims
- 3943US2012111613A1Copper foil with resistance layer, method of production of the same and laminated boardOGURO RYOICHI·Filed 2010·Application pending·0 cites
- 4041US2012205146A1Heat-resistant copper foil and method of producing the same, circuit board, and copper-clad laminate and method of producing the sameOGURO RYOICHI·Filed 2010·Application pending·0 cites
- 4140US2011171486A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA ELECTRIC CO LTD·Filed 2011·Application pending·0 cites
- 4239US6265310B1Method of forming contact holes on a semiconductor surfaceSONY CORP·Filed 1998·Granted Jul 24, 2001·7 cites·7 claims
- 4338US11997402B2Vehicular image capturing system and image capturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted May 28, 2024·0 cites·10 claims
- 4436US2007042212A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFURUKAWA CIRCUIT FOIL·Filed 2006·Application pending·0 cites
- 4531US9951415B2Film deposition apparatus and film deposition methodCANON TOKKI CORP·Filed 2016·Granted Apr 24, 2018·0 cites·2 claims
- 4630US2005019599A1Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foilFiled 2004·Application pending·0 cites
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