Inventor · disambiguated record

Shin-Shyan Hsieh

Also filed as: HSIEH SHIN-SHYAN

1 granted patent·1 pending application·80 citations·filing 2002–2004

51Inventor score

Technology areasH05K H10W

Files withADVANCED SEMICONDUCTOR ENG1

Top patents by PatentIndex Score

2 records

0188US7052935B2Flip-chip package and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 30, 2006·80 cites·5 claims
0229US2003129272A1Mold for an integrated circuit packageFiled 2002·Application pending·0 cites

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Shin-Shyan Hsieh — Patent Inventor | PatentIndex