Inventor · disambiguated record
Shih-Fu Huang
Also filed as: HUANG SHIH-FU · HUANG SHIH-FU ALEX
24 granted patents·3 pending applications·263 citations·filing 2009–2019
95Inventor score
Files withADVANCED SEMICONDUCTOR ENG7RAYMX MICROELECTRONICS CORP5SU YUAN-CHANG4HUANG SHIH-FU3MACRONIX INT CO LTD2
Top patents by PatentIndex Score
27 records- 0196US9406658B2Embedded component device and manufacturing methods thereofLEE CHUN-CHE·Filed 2010·Granted Aug 2, 2016·107 cites·16 claims
- 0295US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0395US8320134B2Embedded component substrate and manufacturing methods thereofSU YUAN-CHANG·Filed 2010·Granted Nov 27, 2012·35 cites·20 claims
- 0492US8284561B2Embedded component package structureSU YUAN-CHANG·Filed 2010·Granted Oct 9, 2012·16 cites·19 claims
- 0591US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 0689US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 0788US8367473B2Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·12 cites·18 claims
- 0885US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
- 0984US8399776B2Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and packageAPPELT BERND KARL·Filed 2009·Granted Mar 19, 2013·16 cites·40 claims
- 1071US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 1171US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 1269US9165900B2Semiconductor package and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 1367US9564346B2Package carrier, semiconductor package, and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 7, 2017·1 cites·20 claims
- 1465US10672499B2NAND flash memory controller and storage apparatus applying the sameRAYMX MICROELECTRONICS CORP·Filed 2019·Granted Jun 2, 2020·2 cites·12 claims
- 1563US8357861B2Circuit board, and chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 22, 2013·2 cites·14 claims
- 1656US9305638B1Operation method for memory deviceMACRONIX INT CO LTD·Filed 2014·Granted Apr 5, 2016·1 cites·11 claims
- 1756US8945994B2Single layer coreless substrateZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTD·Filed 2014·Granted Feb 3, 2015·0 cites·11 claims
- 1854US10705743B2Memory control device, control method of flash memory, and method for generating security feature of flash memoryRAYMX MICROELECTRONICS CORP·Filed 2019·Granted Jul 7, 2020·0 cites·12 claims
- 1950US11449310B2Random number generator, encryption/decryption secret key generator and method based on characteristics of memory cellsRAYMX MICROELECTRONICS CORP·Filed 2019·Granted Sep 20, 2022·0 cites·11 claims
- 2047US11055023B2Electronic device, related controller circuit and methodRAYMX MICROELECTRONICS CORP·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 2146US2011084372A1Package carrier, semiconductor package, and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 2243US2020163229A1Circuit board and method of making circuit boardQI DING TECH QINHUANGDAO CO LTD·Filed 2019·Application pending·0 cites
- 2342US10288258B1Lighting moduleHUANG SHIH FU·Filed 2017·Granted May 14, 2019·0 cites·8 claims
- 2440US8866286B2Single layer coreless substrateZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE TECHNOLOGIES CO LTD·Filed 2012·Granted Oct 21, 2014·0 cites·29 claims
- 2538US10956087B2Memory controller having temperature dependent data program scheme and related methodRAYMX MICROELECTRONICS CORP·Filed 2019·Granted Mar 23, 2021·0 cites·10 claims
- 2635US2010289132A1Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and packageHUANG SHIH-FU·Filed 2010·Application pending·0 cites
- 2732US9548138B2Test method for memoryMACRONIX INT CO LTD·Filed 2014·Granted Jan 17, 2017·0 cites·6 claims
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