Inventor · disambiguated record
Hirofumi Tokita
Also filed as: TOKITA HIROFUMI
18 granted patents·9 pending applications·101 citations·filing 2010–2024
92Inventor score
Files withSANDISK TECHNOLOGIES LLC17RENESAS ELECTRONICS CORP7TOKITA HIROFUMI2WESTERN DIGITAL TECH INC1
Top patents by PatentIndex Score
27 records- 0198US11342245B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 24, 2022·8 cites·20 claims
- 0298US11133252B2Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Sep 28, 2021·12 cites·16 claims
- 0395US11139237B2Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 5, 2021·17 cites·6 claims
- 0495US11114459B2Three-dimensional memory device containing width-modulated connection strips and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Sep 7, 2021·15 cites·23 claims
- 0595US10872857B1Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 22, 2020·17 cites·20 claims
- 0693US11367736B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 21, 2022·9 cites·20 claims
- 0793US11355506B2Through-stack contact via structures for a three-dimensional memory device and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 7, 2022·12 cites·13 claims
- 0884US9553024B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 24, 2017·4 cites·15 claims
- 0980US9831318B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 28, 2017·3 cites·7 claims
- 1072US2024414916A1Three-dimensional memory device including inclined word line contact strips and methods of forming the sameWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1170US10090399B2Semiconductor device and a manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 2, 2018·1 cites·5 claims
- 1264US9236310B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 12, 2016·1 cites·12 claims
- 1364US9013915B2Semiconductor device and method of manufacturing the sameTOKITA HIROFUMI·Filed 2010·Granted Apr 21, 2015·2 cites·13 claims
- 1460US2025248034A1Three-dimensional memory device with a staircase isolation ridge and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1559US2025240955A1Three-dimensional memory device containing scaleless staircase structures and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1659US2025248035A1Three-dimensional memory device with compact staircases and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 1758US2024179907A1Three-dimensional memory device containing etch stop structures for word line contacts and methods of employing the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1858US2024121959A1Multi-tier memory device with different width central staircase regions in different vertical tiers and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 1956US2024251560A1Three-dimensional memory device containing etch stop structures for word line contacts and methods of employing the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2056US2025246237A1Three-dimensional memory device with compact staircases and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2024·Application pending·0 cites
- 2155US12354955B2Three-dimensional memory device with high contact via density and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2255US12347492B2Three-dimensional memory device with high contact via density and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Jul 1, 2025·0 cites·23 claims
- 2353US11398488B2Three-dimensional memory device including through-memory-level via structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jul 26, 2022·0 cites·14 claims
- 2452US9431498B2Semiconductor device including first and second MISFETsRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 30, 2016·0 cites·12 claims
- 2547US9831259B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 28, 2017·0 cites·16 claims
- 2646US9460929B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 4, 2016·0 cites·18 claims
- 2732US2012132997A1Semiconductor device and manufacturing method thereofTOKITA HIROFUMI·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →