Inventor · disambiguated record
Loic Sanchez
Also filed as: SANCHEZ LOIC · SANCHEZ LOÏC
9 granted patents·1 pending application·13 citations·filing 2007–2022
80Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE8COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT1SOITEC SILICON ON INSULATOR1
Top patents by PatentIndex Score
10 records- 0184US11694991B2Method for transferring chipsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Jul 4, 2023·1 cites·16 claims
- 0280US10438921B2Method for direct bonding with self-alignment using ultrasoundCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Oct 8, 2019·4 cites·12 claims
- 0371US9586207B2Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assemblyCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Mar 7, 2017·3 cites·6 claims
- 0470US9240389B2Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozoneCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Jan 19, 2016·3 cites·16 claims
- 0561US7776716B2Method for fabricating a semiconductor on insulator waferSOITEC SILICON ON INSULATOR·Filed 2007·Granted Aug 17, 2010·2 cites·28 claims
- 0655US12463174B2Method for bonding chips to a substrate by direct bondingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted Nov 4, 2025·0 cites·15 claims
- 0754US2023207515A1Method of assembly by direct bonding of electronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 0851US8003550B2Method for revealing emergent dislocations in a germanium-base crystalline elementCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2009·Granted Aug 23, 2011·0 cites·13 claims
- 0946US7846749B2Method and device for monitoring a heat treatment of a microtechnological substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Granted Dec 7, 2010·0 cites·14 claims
- 1041US9455174B2Device and method for individual support of componentsCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT·Filed 2013·Granted Sep 27, 2016·0 cites·8 claims
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