Inventor · disambiguated record

Yoshiko Kohno

Also filed as: KOHNO Yoshiko

2 granted patents·3 citations·filing 2014–2014

43Inventor score

Technology areasB22F

Files withDOWA ELECTRONICS MATERIALS CO LTD2

Top patents by PatentIndex Score

2 records

0173US10328534B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Jun 25, 2019·2 cites·15 claims
0269US9662748B2Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding methodDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted May 30, 2017·1 cites·8 claims

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