Inventor · disambiguated record
Haixiao Sun
Also filed as: SUN HAIXIAO
4 granted patents·3 pending applications·17 citations·filing 2005–2013
71Inventor score
Top patents by PatentIndex Score
7 records- 0174US7670866B2Multi-die molded substrate integrated circuit deviceINTEL CORP·Filed 2007·Granted Mar 2, 2010·10 cites·15 claims
- 0271US7791895B2Surface mount component having magnetic layer thereon and method of forming sameINTEL CORP·Filed 2005·Granted Sep 7, 2010·5 cites·22 claims
- 0370US8378228B2Surface mount component having magnetic layer thereon and method of forming sameINTEL CORP·Filed 2010·Granted Feb 19, 2013·2 cites·15 claims
- 0456US9460866B2Method of forming a surface mount component having magnetic layer thereonINTEL CORP·Filed 2013·Granted Oct 4, 2016·0 cites·9 claims
- 0541US2009001556A1Low temperature thermal interface materialsSUN HAIXIAO·Filed 2007·Application pending·0 cites
- 0640US2008142964A1Tubular-shaped bumps for integrated circuit devices and methods of fabricationSUN HAIXIAO·Filed 2006·Application pending·0 cites
- 0739US2008003780A1Detachable stiffener for ultra-thin dieSUN HAIXIAO·Filed 2006·Application pending·0 cites
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