Inventor · disambiguated record
Shin-Hye Kim
Also filed as: KIM SHIN · KIM SHIN-HYE
17 granted patents·2 pending applications·138 citations·filing 2002–2023
92Inventor score
Top patents by PatentIndex Score
19 records- 0190US8734206B2Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the sameCHANG ONE-MOON·Filed 2011·Granted May 27, 2014·21 cites·11 claims
- 0288US7459745B2Methods of forming capacitors for semiconductor memory devices and resulting semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 2, 2008·15 cites·4 claims
- 0388US7163869B2Shallow trench isolation structure with converted liner layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 16, 2007·50 cites·24 claims
- 0483US10686069B2Semiconductor device having vertical channelSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·5 cites·14 claims
- 0582US7288454B2Methods of forming capacitors for semiconductor memory devices and resulting semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 30, 2007·9 cites·14 claims
- 0676US8252655B2Method of forming semiconductor cell structure, method of forming semiconductor device including the semiconductor cell structure, and method of forming semiconductor module including the semiconductor deviceBAI KEUN-HEE·Filed 2010·Granted Aug 28, 2012·4 cites·20 claims
- 0771US7777212B2Phase change memory devices including carbon-containing adhesive patternSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·7 cites·13 claims
- 0871US6812578B2Semiconductor device bonding pad resistant to stress and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 2, 2004·18 cites·15 claims
- 0966US7880289B2Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 1, 2011·3 cites·30 claims
- 1063US8624354B2Semiconductor devices including 3-D structures with support pad structures and related methods and systemsKIM SHIN-HYE·Filed 2010·Granted Jan 7, 2014·3 cites·23 claims
- 1151USD1012075SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2022·Granted Jan 23, 2024·1 cites·1 claims
- 1248US6982223B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 3, 2006·2 cites·13 claims
- 1347US2009050885A1Semiconductor wafers and methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1444US8790158B2Chemical mechanical polishing apparatusCHANG ONE-MOON·Filed 2011·Granted Jul 29, 2014·0 cites·19 claims
- 1543US2007120230A1Layer structure, method of forming the layer structure, method of manufacturing a capacitor using the same and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1641US7439150B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 21, 2008·0 cites·20 claims
- 1735US8662958B2Chemical-mechanical polishing apparatus for manufacturing semiconductor devicesAHN JONG-SUN·Filed 2011·Granted Mar 4, 2014·0 cites·19 claims
- 1834USD1094348SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·1 claims
- 1934US8697583B2Oxidation-promoting compositions, methods of forming oxide layers, and methods of fabricating semiconductor devicesOH KYUNG-SEOK·Filed 2011·Granted Apr 15, 2014·0 cites·20 claims
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