Inventor · disambiguated record
Takanori Sekido
Also filed as: SEKIDO TAKANORI
35 granted patents·8 pending applications·67 citations·filing 2004–2024
95Inventor score
Top patents by PatentIndex Score
43 records- 0196US10925464B2Imaging unit and endoscopeOLYMPUS CORP·Filed 2020·Granted Feb 23, 2021·4 cites·10 claims
- 0293US7876573B2Stacked mounting structureOLYMPUS CORP·Filed 2007·Granted Jan 25, 2011·32 cites·5 claims
- 0391US11258222B2Cable connection structure, endoscope, and method of manufacturing cable connection structureOLYMPUS CORP·Filed 2021·Granted Feb 22, 2022·2 cites·14 claims
- 0491US9947440B2Mounting cable and method for manufacturing mounting cableOLYMPUS CORP·Filed 2017·Granted Apr 17, 2018·4 cites·10 claims
- 0577US9520212B2Aligned structure of cables and production method of aligned structure of cablesOLYMPUS CORP·Filed 2013·Granted Dec 13, 2016·2 cites·6 claims
- 0673US12046860B2Cable connection structure manufacturing methodOLYMPUS CORP·Filed 2021·Granted Jul 23, 2024·0 cites·8 claims
- 0773US10898060B2Cable connection structure, endoscope system, and method of manufacturing cable connection structureOLYMPUS CORP·Filed 2018·Granted Jan 26, 2021·3 cites·10 claims
- 0872US10741942B2Cable mounting structure and endoscopeOLYMPUS CORP·Filed 2019·Granted Aug 11, 2020·1 cites·8 claims
- 0972US8787743B2Cable connection structure and endoscope apparatusOLYMPUS CORP·Filed 2012·Granted Jul 22, 2014·5 cites·19 claims
- 1071US10426324B2Imaging apparatus including an image sensor chip mount assemblyOLYMPUS CORP·Filed 2016·Granted Oct 1, 2019·2 cites·4 claims
- 1170US11945172B2Endoscopic bendable tube, endoscope, and method of manufacturing endoscopic bendable tubeOLYMPUS CORP·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1270US7649740B2Stacked mounting structureOLYMPUS CORP·Filed 2008·Granted Jan 19, 2010·4 cites·7 claims
- 1369US11303046B2Cable connection structureOLYMPUS CORP·Filed 2021·Granted Apr 12, 2022·0 cites·16 claims
- 1469US10062480B2Cable connection structure, cable assembly, method for manufacturing cable assembly, and method for manufacturing cable connection structureOLYMPUS CORP·Filed 2015·Granted Aug 28, 2018·1 cites·2 claims
- 1566US8912445B2Cable assemblySEKIDO TAKANORI·Filed 2012·Granted Dec 16, 2014·4 cites·6 claims
- 1664US12446757B2Image pickup unit and endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Granted Oct 21, 2025·0 cites·14 claims
- 1764US7679196B2Stacked mounting structureOLYMPUS CORP·Filed 2006·Granted Mar 16, 2010·2 cites·17 claims
- 1860US2025031302A1Multilayer three-dimensional circuit substrate, endoscope, and method for manufacturing multilayer three-dimensional circuit substrateOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 1959US12487445B2Image pickup unit and endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Granted Dec 2, 2025·0 cites·7 claims
- 2059US2019206589A1Mounting cable and cable assemblyOLYMPUS CORP·Filed 2019·Application pending·0 cites
- 2158US2024334036A1Image pickup unit and endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 2257US12082784B2Electronic module, method of manufacturing electronic module, and endoscopeOLYMPUS CORP·Filed 2022·Granted Sep 10, 2024·0 cites·10 claims
- 2357US8437144B2Laminate mount assemblySEKIDO TAKANORI·Filed 2010·Granted May 7, 2013·1 cites·4 claims
- 2456US10090611B2Cable, cable connection structure, and imaging apparatusOLYMPUS CORP·Filed 2014·Granted Oct 2, 2018·0 cites·4 claims
- 2555US11962103B2Cable connection structure, endoscope, and method of manufacturing cable connection structureOLYMPUS CORP·Filed 2020·Granted Apr 16, 2024·0 cites·16 claims
- 2653US11259693B2Cable connection substrate, imaging apparatus, endoscope, and method of manufacturing imaging apparatusOLYMPUS CORP·Filed 2018·Granted Mar 1, 2022·0 cites·12 claims
- 2752US9490191B2Mounting structure of semiconductor device and method of manufacturing the sameOLYMPUS CORP·Filed 2013·Granted Nov 8, 2016·0 cites·5 claims
- 2852US9343863B2Method for manufacturing mount assemblyOLYMPUS CORP·Filed 2013·Granted May 17, 2016·0 cites·4 claims
- 2952US2007095563A1Circuit board having deformation interrupting section and circuit board forming methodOLYMPUS CORP·Filed 2006·Application pending·0 cites
- 3051US9281294B2Multi-chip semiconductor deviceOLYMPUS CORP·Filed 2013·Granted Mar 8, 2016·0 cites·2 claims
- 3151US2010254109A1Mount assembly and method for manufacturing mount assemblyOLYMPUS CORP·Filed 2010·Application pending·0 cites
- 3249US10084947B2Imaging moduleOLYMPUS CORP·Filed 2014·Granted Sep 25, 2018·0 cites·5 claims
- 3349US9583416B2Mounting structure of semiconductor device and method of manufacturing the sameOLYMPUS CORP·Filed 2016·Granted Feb 28, 2017·0 cites·5 claims
- 3448US10456013B2Cable connection structure, imaging apparatus, and endoscopeOLYMPUS CORP·Filed 2018·Granted Oct 29, 2019·0 cites·12 claims
- 3547US9905534B2Multi-chip semiconductor deviceOLYMPUS CORP·Filed 2016·Granted Feb 27, 2018·0 cites·5 claims
- 3646US10966594B2Imaging device, endoscope, and method of manufacturing imaging deviceOLYMPUS CORP·Filed 2018·Granted Apr 6, 2021·0 cites·7 claims
- 3745US10290393B2Mounting cable and cable assemblyOLYMPUS CORP·Filed 2015·Granted May 14, 2019·0 cites·12 claims
- 3845US9408309B2Electronic component mounting structureOLYMPUS CORP·Filed 2014·Granted Aug 2, 2016·0 cites·16 claims
- 3944US11125990B2Endoscope distal end portion, endoscope, and method of manufacturing endoscope distal end portionOLYMPUS CORP·Filed 2020·Granted Sep 21, 2021·0 cites·6 claims
- 4044US9219888B2Image pickup unit and endoscopeOLYMPUS CORP·Filed 2013·Granted Dec 22, 2015·0 cites·4 claims
- 4143US2010277878A1Mounting structureOLYMPUS CORP·Filed 2010·Application pending·0 cites
- 4243US2004168824A1Circuit board having deformation interrupting section and circuit board forming methodOLYMPUS CORP·Filed 2004·Application pending·0 cites
- 4339US2018070799A1Imaging device, endoscope system, and method of manufacturing imaging deviceOLYMPUS CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →