Inventor · disambiguated record

Tingwen Wei

Also filed as: WEI TINGWEN

1 granted patent·0 citations·filing 2021–2021

9Inventor score

Technology areasC07C

Files withNANJING UNIVERSITY OF TECHNOLOGY1

Top patents by PatentIndex Score

1 record

0162US11845708B2Method for photocleavage of amide bondsNANJING UNIVERSITY OF TECHNOLOGY·Filed 2021·Granted Dec 19, 2023·0 cites·7 claims

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