Inventor · disambiguated record
Ta-Jen Yu
Also filed as: YU TA-JEN
29 granted patents·11 pending applications·94 citations·filing 2010–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0196US8048778B1Methods of dicing a semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·36 cites·20 claims
- 0293US10236187B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2018·Granted Mar 19, 2019·3 cites·20 claims
- 0390US10553526B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Feb 4, 2020·5 cites·21 claims
- 0488US10573616B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2016·Granted Feb 25, 2020·4 cites·26 claims
- 0588US9922844B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 20, 2018·5 cites·12 claims
- 0687US9177899B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2012·Granted Nov 3, 2015·9 cites·8 claims
- 0786US10217716B2Semiconductor package and method for fabricating the sameMEDIATEK INC·Filed 2017·Granted Feb 26, 2019·8 cites·6 claims
- 0885US10573536B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2019·Granted Feb 25, 2020·2 cites·20 claims
- 0984US11450606B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2019·Granted Sep 20, 2022·3 cites·11 claims
- 1084US10756040B2Semiconductor package with rigid under bump metallurgy (UBM) stackMEDIATEK INC·Filed 2018·Granted Aug 25, 2020·4 cites·19 claims
- 1181US10115604B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2015·Granted Oct 30, 2018·2 cites·22 claims
- 1279US9553040B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Jan 24, 2017·3 cites·26 claims
- 1379US9520349B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Dec 13, 2016·2 cites·20 claims
- 1477US10580747B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 3, 2020·2 cites·21 claims
- 1577US10573615B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Feb 25, 2020·2 cites·21 claims
- 1672US10916449B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2020·Granted Feb 9, 2021·0 cites·18 claims
- 1770US9437457B2Chip package having a patterned conducting plate and method for forming the sameMEDIATEK INC·Filed 2013·Granted Sep 6, 2016·2 cites·17 claims
- 1869US11854784B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·0 cites·12 claims
- 1968US11791266B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Oct 17, 2023·0 cites·16 claims
- 2066US9627311B2Chip package, package substrate and manufacturing method thereofMEDIATEK INC·Filed 2015·Granted Apr 18, 2017·1 cites·11 claims
- 2164US11469201B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 2263US9972593B2Semiconductor packageMEDIATEK INC·Filed 2014·Granted May 15, 2018·1 cites·32 claims
- 2360US2024332266A1Semiconductor deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2460US2025233040A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2559US2020312732A1Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2020·Application pending·0 cites
- 2657US10236242B2Chip package and package substrateMEDIATEK INC·Filed 2017·Granted Mar 19, 2019·0 cites·22 claims
- 2757US2023307421A1Package-on-package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2857US2023422525A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2956US9852973B2Manufacturing method of chip package and package substrateMEDIATEK INC·Filed 2017·Granted Dec 26, 2017·0 cites·20 claims
- 3056US2024274517A1Semiconductor package structure, method of forming the same and semiconductor package assembly having the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3156US2023282604A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3255US10312210B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Jun 4, 2019·0 cites·14 claims
- 3355US9633936B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
- 3454US9373526B2Chip package and method for forming the sameMEDIATEK INC·Filed 2014·Granted Jun 21, 2016·0 cites·9 claims
- 3554US2023282625A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3653US2023260866A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3752US2023282626A1High-bandwidth package-on-package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 3851US2023046413A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
- 3948US10340198B2Semiconductor package with embedded supporter and method for fabricating the sameMEDIATEK INC·Filed 2018·Granted Jul 2, 2019·0 cites·25 claims
- 4043US10074581B2Chip package having a patterned conducting plate and a conducting pad with a recessMEDIATEK INC·Filed 2016·Granted Sep 11, 2018·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →