Inventor · disambiguated record
Chih-Hang Chang
Also filed as: CHANG CHIH-HANG
14 granted patents·2 pending applications·10 citations·filing 2016–2025
86Inventor score
Top patents by PatentIndex Score
16 records- 0192US11174156B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0288US12258265B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0388US11626177B1Anti-fuse sensing device and operation method thereofNANYA TECHNOLOGY CORP·Filed 2021·Granted Apr 11, 2023·2 cites·16 claims
- 0484US11192775B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 0579US2025187907A1Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0677US9725312B1Preconditioning to enhance hydrophilic fusion bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·20 claims
- 0775US11772963B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 0870US10273141B2Rough layer for better anti-stiction depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·1 cites·20 claims
- 0968US10626010B2Bonding process for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·20 claims
- 1064US12451890B2Power down circuit and power down methodNANYA TECHNOLOGY CORP·Filed 2023·Granted Oct 21, 2025·0 cites·9 claims
- 1163US12244330B2Transmission deviceNANYA TECHNOLOGY CORP·Filed 2022·Granted Mar 4, 2025·0 cites·10 claims
- 1259US12007800B2Power voltage supply device with automatic temperature compensationNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 11, 2024·0 cites·15 claims
- 1356US12185530B2Anti-fuse sensing device and operation method thereofNANYA TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·0 cites·11 claims
- 1456US2024355696A1Method of filling gaps between dies using silicon dioxideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1548US10112826B2Method for forming micro-electro-mechanical system (MEMS) device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·20 claims
- 1644US11211354B2Systems and methods for semi-flexible eutectic bonder piece arranegmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →