Inventor · disambiguated record
Zhihai Wang
Also filed as: WANG ZHIHAI
44 granted patents·4 pending applications·1,015 citations·filing 1992–2020
98Inventor score
Top patents by PatentIndex Score
48 records- 0195US8779540B2Light sensor having transparent substrate with lens formed thereinKERNESS NICOLE D·Filed 2011·Granted Jul 15, 2014·20 cites·7 claims
- 0295US6028015AProcess for treating damaged surfaces of low dielectric constant organo silicon oxide insulation material to inhibit moisture absorptionLSI LOGIC CORP·Filed 1999·Granted Feb 22, 2000·173 cites·14 claims
- 0393US8803068B2Light sensor having a contiguous IR suppression filter and a transparent substrateKERNESS NICOLE D·Filed 2011·Granted Aug 12, 2014·9 cites·22 claims
- 0493US8624341B2Light sensor having IR cut and color pass interference filter integrated on-chipHOLENARSIPUR PRASHANTH·Filed 2011·Granted Jan 7, 2014·14 cites·41 claims
- 0593US6881664B2Process for planarizing upper surface of damascene wiring structure for integrated circuit structuresLSI LOGIC CORP·Filed 2003·Granted Apr 19, 2005·75 cites·16 claims
- 0693US6727177B1Multi-step process for forming a barrier film for use in copper layer formationLSI LOGIC CORP·Filed 2001·Granted Apr 27, 2004·58 cites·21 claims
- 0792US8749007B1Light sensor having transparent substrate and diffuser formed thereinKERNESS NICOLE D·Filed 2011·Granted Jun 10, 2014·10 cites·5 claims
- 0890US8791404B2Light sensor having a transparent substrate, a contiguous IR suppression filter and through-substrate viasKERNESS NICOLE D·Filed 2011·Granted Jul 29, 2014·8 cites·22 claims
- 0990US8598672B2Light sensor having IR cut interference filter with color filter integrated on-chipWANG ZHIHAI·Filed 2011·Granted Dec 3, 2013·13 cites·43 claims
- 1090US6368979B1Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structureLSI LOGIC CORP·Filed 2000·Granted Apr 9, 2002·52 cites·26 claims
- 1190US5364186AApparatus and method for monitoring a temperature using a thermally fused composite ceramic blackbody temperature probeLUXTRON CORP·Filed 1992·Granted Nov 15, 1994·97 cites·5 claims
- 1289US5902129AProcess for forming improved cobalt silicide layer on integrated circuit structure using two capping layersLSI LOGIC CORP·Filed 1997·Granted May 11, 1999·87 cites·20 claims
- 1389US5660682APlasma clean with hydrogen gasLSI LOGIC CORP·Filed 1996·Granted Aug 26, 1997·100 cites·18 claims
- 1488US8809099B2Light sensor having IR cut interference filter with color filter integrated on-chipMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 19, 2014·4 cites·15 claims
- 1586US8803270B2Light sensor having IR cut and color pass interference filter integrated on-chipMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 12, 2014·3 cites·17 claims
- 1683US9472696B1Light sensor having a contiguous IR suppression filter and transparent substrateMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 18, 2016·2 cites·21 claims
- 1782US7413984B2Multi-step process for forming a barrier film for use in copper layer formationLSI CORP·Filed 2007·Granted Aug 19, 2008·6 cites·6 claims
- 1882US5874342AProcess for forming MOS device in integrated circuit structure using cobalt silicide contacts as implantation mediaLSI LOGIC CORP·Filed 1997·Granted Feb 23, 1999·69 cites·22 claims
- 1981US9224884B2Light sensor having transparent substrate and diffuser formed thereinMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Dec 29, 2015·3 cites·16 claims
- 2081US9224890B1Light sensor having transparent substrate with lens formed thereinMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Dec 29, 2015·3 cites·16 claims
- 2179US5770520AMethod of making a barrier layer for via or contact opening of integrated circuit structureLSI LOGIC CORP·Filed 1996·Granted Jun 23, 1998·57 cites·21 claims
- 2277US12172165B2Reaction vessel, molecular hybridization apparatus, application thereof, and detection methodLEADWAY HK LTD·Filed 2019·Granted Dec 24, 2024·1 cites·14 claims
- 2374US6736953B1High frequency electrochemical depositionLSI LOGIC CORP·Filed 2001·Granted May 18, 2004·8 cites·13 claims
- 2472US9129874B1Light sensor having IR cut interference filter with color filter integrated on-chipMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Sep 8, 2015·0 cites·14 claims
- 2568US7229923B2Multi-step process for forming a barrier film for use in copper layer formationLSI CORP·Filed 2004·Granted Jun 12, 2007·9 cites·26 claims
- 2668US6472314B1Diamond barrier layerLSI LOGIC CORP·Filed 2001·Granted Oct 29, 2002·12 cites·16 claims
- 2766US6569751B1Low via resistance systemLSI LOGIC CORP·Filed 2000·Granted May 27, 2003·9 cites·17 claims
- 2865US8948087B2Method and system for implementing domain selection during the terminated callHU YING·Filed 2010·Granted Feb 3, 2015·2 cites·18 claims
- 2960US6204550B1Method and composition for reducing gate oxide damage during RF sputter cleanLSI LOGIC CORP·Filed 1999·Granted Mar 20, 2001·20 cites·11 claims
- 3059US6010952AProcess for forming metal silicide contacts using amorphization of exposed silicon while minimizing device degradationLSI LOGIC CORP·Filed 1997·Granted Jan 4, 2000·24 cites·21 claims
- 3159US5994211AMethod and composition for reducing gate oxide damage during RF sputter cleanLSI LOGIC CORP·Filed 1997·Granted Nov 30, 1999·20 cites·15 claims
- 3258US9472586B1Light sensor having transparent substrate and through-substrate vias and a contiguous IR suppression filterMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 18, 2016·0 cites·22 claims
- 3358US6734560B2Diamond barrier layerLSI LOGIC CORP·Filed 2002·Granted May 11, 2004·6 cites·4 claims
- 3456US6767832B1In situ liner barrierLSI LOGIC CORP·Filed 2001·Granted Jul 27, 2004·5 cites·6 claims
- 3552US7081406B2Interconnect dielectric tuningLSI LOGIC CORP·Filed 2004·Granted Jul 25, 2006·4 cites·13 claims
- 3652US6174798B1Process for forming metal interconnect stack for integrated circuit structureLSI LOGIC CORP·Filed 1999·Granted Jan 16, 2001·15 cites·8 claims
- 3751US6087726AMetal interconnect stack for integrated circuit structureLSI LOGIC CORP·Filed 1999·Granted Jul 11, 2000·14 cites·11 claims
- 3849US7259462B1Interconnect dielectric tuningLSI CORP·Filed 2006·Granted Aug 21, 2007·0 cites·4 claims
- 3946US6489231B1Method for forming barrier and seed layerLSI LOGIC CORP·Filed 2001·Granted Dec 3, 2002·3 cites·18 claims
- 4045US2010302937A1Control Method, System, and Device for Circuit Domain FallbackHU YING·Filed 2009·Application pending·0 cites
- 4142US6893962B2Low via resistance systemLSI LOGIC CORP·Filed 2003·Granted May 17, 2005·0 cites·3 claims
- 4240US2003064593A1Barrier and seed layer systemLSI LOGIC CORP·Filed 2002·Application pending·0 cites
- 4338US2006035457A1Interconnection capacitance reductionCARTER RICHARD J·Filed 2004·Application pending·0 cites
- 4437US2003084587A1Substrate processing systemLSI LOGIC CORP·Filed 2002·Application pending·0 cites
- 4536US12061662B2Methods, apparatuses and systems for displaying alarm fileHANGZHOU HIKVISION DIGITAL TEC·Filed 2020·Granted Aug 13, 2024·0 cites·12 claims
- 4635US9078119B2Method and system for acquiring information of machine type communication user equipmentLI ZHIJUN·Filed 2010·Granted Jul 7, 2015·0 cites·18 claims
- 4735US6518193B1Substrate processing systemLSI LOGIC CORP·Filed 2001·Granted Feb 11, 2003·0 cites·6 claims
- 4827US9112716B2Method and system for obtaining access information and charging in multimedia broadcast/multicast serviceGUO WENJIE·Filed 2010·Granted Aug 18, 2015·0 cites·15 claims
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