Inventor · disambiguated record
Dong Han Kho
Also filed as: KHO DONG H · KHO DONG HAN
10 granted patents·4 pending applications·31 citations·filing 2006–2013
83Inventor score
Top patents by PatentIndex Score
14 records- 0191US8436122B2Pressure sensitive adhesive composition for transporting flexible substrateKHO DONG-HAN·Filed 2007·Granted May 7, 2013·22 cites·15 claims
- 0268US9695345B2Dicing die bonding film having excellent burr property and reliability and semiconductor device using the sameYOO HYUN JEE·Filed 2008·Granted Jul 4, 2017·4 cites·11 claims
- 0363US8128773B2Pressure sensitive adhesive for transporting flexible substrateCHUN SANG-KI·Filed 2007·Granted Mar 6, 2012·3 cites·18 claims
- 0459US9659763B2Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor deviceYOO HYUN JEE·Filed 2009·Granted May 23, 2017·0 cites·15 claims
- 0557US8541289B2Dicing die bonding film and dicing methodHONG JONG WAN·Filed 2008·Granted Sep 24, 2013·1 cites·11 claims
- 0654US8207616B2Adhesive film, dicing die bonding film and semiconductor device using the sameHONG JONG WAN·Filed 2008·Granted Jun 26, 2012·1 cites·20 claims
- 0752US10011743B2Dielectric adhesive film for electronic paper display deviceKHO DONG HAN·Filed 2012·Granted Jul 3, 2018·0 cites·12 claims
- 0852US9793103B2Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor deviceLG CHEMICAL LTD·Filed 2013·Granted Oct 17, 2017·0 cites·13 claims
- 0951US9018303B2Acrylic pressure sensitive adhesive compositions having plasticizerKHO DONG HAN·Filed 2007·Granted Apr 28, 2015·0 cites·16 claims
- 1049US2007191517A1Acrylic pressure sensitive adhesive compositionLG CHEMICAL LTD·Filed 2006·Application pending·0 cites
- 1148US2013171399A1Dielectric adhesive film for electronic paper display deviceKHO DONG HAN·Filed 2011·Application pending·0 cites
- 1248US2010285244A1Acrylic pressure sensitive adhesive compositionsKHO DONG HAN·Filed 2007·Application pending·0 cites
- 1342US8182913B2Bi-layer structured sheet having excellent printability when printed by hard roll and method for producing the sameCHUN SANG KI·Filed 2007·Granted May 22, 2012·0 cites·18 claims
- 1438US2006289892A1Method for preparing light emitting diode device having heat dissipation rate enhancementLEE JAE S·Filed 2006·Application pending·0 cites
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