Inventor · disambiguated record
Jong Wan Hong
Also filed as: HONG JONG WAN
5 granted patents·2 pending applications·6 citations·filing 2008–2013
68Inventor score
Top patents by PatentIndex Score
7 records- 0168US9695345B2Dicing die bonding film having excellent burr property and reliability and semiconductor device using the sameYOO HYUN JEE·Filed 2008·Granted Jul 4, 2017·4 cites·11 claims
- 0259US9659763B2Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor deviceYOO HYUN JEE·Filed 2009·Granted May 23, 2017·0 cites·15 claims
- 0357US8541289B2Dicing die bonding film and dicing methodHONG JONG WAN·Filed 2008·Granted Sep 24, 2013·1 cites·11 claims
- 0454US8207616B2Adhesive film, dicing die bonding film and semiconductor device using the sameHONG JONG WAN·Filed 2008·Granted Jun 26, 2012·1 cites·20 claims
- 0552US9793103B2Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor deviceLG CHEMICAL LTD·Filed 2013·Granted Oct 17, 2017·0 cites·13 claims
- 0647US2011091676A1Pressure-sensitive adhesive film and back-grinding method using the sameLG CHEMICAL LTD·Filed 2009·Application pending·0 cites
- 0746US2012270381A1Die attach filmJOO HYO SOOK·Filed 2009·Application pending·0 cites
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