Inventor · disambiguated record
Hugh J. Griffin
Also filed as: GRIFFIN HUGH J
28 granted patents·4 pending applications·154 citations·filing 2006–2021
96Inventor score
Files withICEMOS TECHNOLOGY LTD19ICEMOS TECHNOLOGY CORP5WILSON ROBIN3ICEMOS TECH LIMITED2ISHIGURO TAKESHI2
Top patents by PatentIndex Score
32 records- 0194US7576404B2Backlit photodiode and method of manufacturing a backlit photodiodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Aug 18, 2009·28 cites·4 claims
- 0293US7446018B2Bonded-wafer superjunction semiconductor deviceICEMOS TECHNOLOGY CORP·Filed 2006·Granted Nov 4, 2008·33 cites·18 claims
- 0390US7560791B2Front lit PIN/NIP diode having a continuous anode/cathodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jul 14, 2009·13 cites·7 claims
- 0489US7972934B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Jul 5, 2011·10 cites·14 claims
- 0588US7601556B2Front side electrical contact for photodetector array and method of making sameICEMOS TECHNOLOGY LTD·Filed 2008·Granted Oct 13, 2009·10 cites·8 claims
- 0687US7553764B2Silicon wafer having through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jun 30, 2009·14 cites·11 claims
- 0785US7528458B2Photodiode having increased proportion of light-sensitive area to light-insensitive areaICEMOS TECHNOLOGY LTD·Filed 2007·Granted May 5, 2009·7 cites·13 claims
- 0882US7741141B2Photodiode having increased proportion of light-sensitive area to light-insensitive areaICEMOS TECHNOLOGY LTD·Filed 2009·Granted Jun 22, 2010·5 cites·7 claims
- 0982US7429772B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2006·Granted Sep 30, 2008·6 cites·9 claims
- 1080US7768085B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2006·Granted Aug 3, 2010·4 cites·7 claims
- 1179US8114751B2Multi-angle rotation for ion implantation of trenches in superjunction devicesISHIGURO TAKESHI·Filed 2010·Granted Feb 14, 2012·4 cites·13 claims
- 1278US7579667B2Bonded-wafer superjunction semiconductor deviceICEMOS TECHNOLOGY LTD·Filed 2008·Granted Aug 25, 2009·7 cites·6 claims
- 1372US8058091B2Front lit PIN/NIP diode having a continuous anode/cathodeWILSON ROBIN·Filed 2008·Granted Nov 15, 2011·2 cites·10 claims
- 1468US7846821B2Multi-angle rotation for ion implantation of trenches in superjunction devicesICEMOS TECHNOLOGY LTD·Filed 2009·Granted Dec 7, 2010·2 cites·7 claims
- 1568US7489014B2Front side electrical contact for photodetector array and method of making sameICEMOS TECHNOLOGY LTD·Filed 2007·Granted Feb 10, 2009·1 cites·12 claims
- 1667US7579273B2Method of manufacturing a photodiode array with through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2007·Granted Aug 25, 2009·3 cites·21 claims
- 1766US7795045B2Trench depth monitor for semiconductor manufacturingICEMOS TECHNOLOGY LTD·Filed 2009·Granted Sep 14, 2010·2 cites·22 claims
- 1865US7439178B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2007·Granted Oct 21, 2008·1 cites·11 claims
- 1961US12222316B2Semiconductor device providing a biosensor to test for pathogenICEMOS TECH LIMITED·Filed 2021·Granted Feb 11, 2025·0 cites·28 claims
- 2061US7821089B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Oct 26, 2010·0 cites·16 claims
- 2158US7999348B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Aug 16, 2011·0 cites·10 claims
- 2254US7910479B2Method of manufacturing a photodiode array with through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2009·Granted Mar 22, 2011·0 cites·19 claims
- 2353US8148203B2Technique for stable processing of thin/fragile substratesWILSON ROBIN·Filed 2011·Granted Apr 3, 2012·0 cites·14 claims
- 2453US2022236261A1Semiconductor Device Providing a Biosensor to Test for PathogenICEMOS TECH LIMITED·Filed 2021·Application pending·0 cites
- 2552US2009253261A1Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeICEMOS TECHNOLOGY LTD·Filed 2009·Application pending·0 cites
- 2651US8012806B2Multi-directional trenching of a die in manufacturing superjunction devicesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Sep 6, 2011·0 cites·15 claims
- 2748US9543380B2Multi-directional trenching of a die in manufacturing superjunction devicesISHIGURO TAKESHI·Filed 2011·Granted Jan 10, 2017·0 cites·5 claims
- 2848US7741172B2Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jun 22, 2010·2 cites·17 claims
- 2948US2008099924A1Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 3043US2008122040A1Varying Pitch Adapter and a Method of Forming a Varying Pitch AdapterICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 3142US9576842B2Grass removal in patterned cavity etchingICEMOS TECH LTD·Filed 2013·Granted Feb 21, 2017·0 cites·17 claims
- 3238US8169057B2Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diodeWILSON ROBIN·Filed 2008·Granted May 1, 2012·0 cites·9 claims
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