Inventor · disambiguated record
Fang-Tsun Chu
Also filed as: CHU FANG-TSUN
17 granted patents·7 pending applications·93 citations·filing 2003–2020
93Inventor score
Top patents by PatentIndex Score
24 records- 0194US9117677B2Semiconductor integrated circuit having a resistor and method of forming the sameMa wei yu·Filed 2011·Granted Aug 25, 2015·24 cites·20 claims
- 0290US7221012B2Pixel arrayIND TECH RES INST·Filed 2006·Granted May 22, 2007·19 cites·18 claims
- 0389US8569129B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsMa wei yu·Filed 2011·Granted Oct 29, 2013·9 cites·20 claims
- 0488US8179647B2ESD power clamp for high-voltage applicationsCHU FANG-TSUN·Filed 2010·Granted May 15, 2012·11 cites·16 claims
- 0587US9245852B2ESD protection for 2.5D/3D integrated circuit systemsCHEN CHIA-HUI·Filed 2011·Granted Jan 26, 2016·8 cites·21 claims
- 0684US9406607B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·5 cites·20 claims
- 0782US10269699B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 0881US9893010B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·2 cites·20 claims
- 0977US7736483B2Method for electroplating metal wireIND TECH RES INST·Filed 2007·Granted Jun 15, 2010·2 cites·8 claims
- 1077US7180090B2Method of forming thin-film transistor devices with electro-static discharge protectionIND TECH RES INST·Filed 2005·Granted Feb 20, 2007·6 cites·5 claims
- 1171US11075162B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 1263US10629528B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 1362US7579123B2Method for crystallizing amorphous silicon into polysilicon and mask used thereforIND TECH RES INST·Filed 2006·Granted Aug 25, 2009·1 cites·36 claims
- 1452US7772135B2Method for forming poly-silicon filmIND TECH RES INST·Filed 2006·Granted Aug 10, 2010·1 cites·21 claims
- 1552US2009098471A1Mask for sequential lateral solidification laser crystallizationIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1651US10262989B2ESD protection for 2.5D/3D integrated circuit systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 16, 2019·0 cites·20 claims
- 1749US2008045042A1Method for crystalizing amorphous silicon layer and mask thereforIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1849US2008123200A1Method and device for forming poly-silicon filmIND TECH RES INST·Filed 2007·Application pending·0 cites
- 1948US6989298B2Method of forming thin-film transistor devices with electro-static discharge protectionIND TECH RES INST·Filed 2004·Granted Jan 24, 2006·3 cites·13 claims
- 2045US2004129572A1Method for electroplating metal wireIND TECH RES INST·Filed 2003·Application pending·0 cites
- 2142US7611807B2Method for forming poly-silicon filmIND TECH RES INST·Filed 2006·Granted Nov 3, 2009·0 cites·5 claims
- 2240US2007190705A1Method for forming poly-silicon thin-film deviceIND TECH RES INST·Filed 2006·Application pending·0 cites
- 2339US2010103401A1Method and device for forming poly-silicon filmCHU FANG-TSUN·Filed 2010·Application pending·0 cites
- 2436US2008233718A1Method of Semiconductor Thin Film Crystallization and Semiconductor Device FabricationLIN JIA-XING·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →