Inventor · disambiguated record
Alexander Huettis
Also filed as: HUETTIS ALEXANDER · HUETTIS ALEXANDER W
2 granted patents·2 pending applications·0 citations·filing 2019–2024
25Inventor score
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0168US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0255US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 0354US11569596B2Pressure features to alter the shape of a socketINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 0449US2025105114A1N-ball second level interconnect package architectureINTEL CORP·Filed 2023·Application pending·0 cites
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