Inventor · disambiguated record
Tomoki Kawasaki
Also filed as: KAWASAKI TOMOKI
1 granted patent·2 pending applications·4 citations·filing 2005–2024
26Inventor score
Top patents by PatentIndex Score
3 records- 0166US7952177B2Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die padsPANASONIC CORP·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 0252US2025229728A1Vehicle exterior componentTOYODA GOSEI KK·Filed 2024·Application pending·0 cites
- 0341US2006097371A1Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die padsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →