Inventor · disambiguated record

Harry Liang

Also filed as: LIANG HARRY Y

1 granted patent·1 pending application·29 citations·filing 2004–2005

46Inventor score

Technology areasH10W

Files withBARNAK JOHN P1 INTEL CORP1

Top patents by PatentIndex Score

2 records

0179US7064446B2Under bump metallization layer to enable use of high tin content solder bumpsINTEL CORP·Filed 2004·Granted Jun 20, 2006·29 cites·6 claims
0240US2005250323A1Under bump metallization layer to enable use of high tin content solder bumpsBARNAK JOHN P·Filed 2005·Application pending·0 cites

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