Inventor · disambiguated record
Frank Stepniak
Also filed as: KOMINIAK ANDREW A · STEPNIAK FRANK · STEPNIAK FRANK M
42 granted patents·7 pending applications·1,398 citations·filing 1976–2024
98Inventor score
Top patents by PatentIndex Score
49 records- 0197US7216426B2Method for forming a separable electrical connectorTHOMAS & BETTS INT·Filed 2006·Granted May 15, 2007·77 cites·10 claims
- 0297US4863392AHigh-voltage loadbreak bushing insert connectorAMERACE CORP·Filed 1988·Granted Sep 5, 1989·108 cites·21 claims
- 0396US7044760B2Separable electrical connector assemblyTHOMAS & BETTS INT·Filed 2004·Granted May 16, 2006·62 cites·25 claims
- 0496US6168447B1Loadbreak connector assembly which prevents switching flashoverTHOMAS & BETTS INT·Filed 1999·Granted Jan 2, 2001·104 cites·21 claims
- 0595US4186985AElectrical connectorAMERACE CORP·Filed 1978·Granted Feb 5, 1980·88 cites·19 claims
- 0694US7397012B2High current switch and method of operationTHOMAS & BETTS INT·Filed 2005·Granted Jul 8, 2008·26 cites·29 claims
- 0794US6585531B1Loadbreak connector assembly which prevents switching flashoverTHOMAS & BETTS INT·Filed 2000·Granted Jul 1, 2003·63 cites·22 claims
- 0894US6281106B1Method of solder bumping a circuit componentDELPHI TECH INC·Filed 1999·Granted Aug 28, 2001·106 cites·21 claims
- 0993US5957712ALoadbreak connector assembly which prevents switching flashoverTHOMAS & BETTS INT·Filed 1997·Granted Sep 28, 1999·80 cites·15 claims
- 1093US5641306AIndicator bands which show rating and proper assembly of high voltage accessoriesAMERACE CORP·Filed 1995·Granted Jun 24, 1997·80 cites·14 claims
- 1192US9572261B2Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2015·Granted Feb 14, 2017·8 cites·19 claims
- 1292US7579571B2Visible open indicatorTHOMAS & BETTS INT·Filed 2006·Granted Aug 25, 2009·24 cites·18 claims
- 1392US7503785B2Separable electrical connector component having a voltage output branch and a direct access pointTHOMAS & BETTS INT·Filed 2006·Granted Mar 17, 2009·41 cites·19 claims
- 1491US6939151B2Loadbreak connector assembly which prevents switching flashoverTHOMAS & BETTS INT·Filed 2002·Granted Sep 6, 2005·55 cites·69 claims
- 1590US6375062B1Surface bumping method and structure formed therebyDELPHI TECH INC·Filed 2000·Granted Apr 23, 2002·51 cites·11 claims
- 1689US6802446B2Conductive adhesive material with metallurgically-bonded conductive particlesDELPHI TECH INC·Filed 2002·Granted Oct 12, 2004·48 cites·26 claims
- 1788US4600260AElectrical connectorAMERACE CORP·Filed 1981·Granted Jul 15, 1986·51 cites·42 claims
- 1887US7754992B2High current switch and method of operationTHOMAS & BETTS INT·Filed 2009·Granted Jul 13, 2010·12 cites·16 claims
- 1986US7501598B2Connector system for an insulated switch with provision for grounding and visible breakTHOMAS & BETTS INT·Filed 2006·Granted Mar 10, 2009·14 cites·21 claims
- 2086US5573410AVariable size entry insert for cable accessories and methodAMERACE CORP·Filed 1995·Granted Nov 12, 1996·51 cites·5 claims
- 2185US7579572B2High current switch and method of operationTHOMAS & BETTS INT·Filed 2008·Granted Aug 25, 2009·10 cites·20 claims
- 2284US7288718B2Separable electrical connector component for sending and receiving communication signals through underground power distribution linesTHOMAS & BETTS INT·Filed 2005·Granted Oct 30, 2007·23 cites·25 claims
- 2384US6491548B2Elbow canister fuseholderTHOMAS & BETTS INT·Filed 2001·Granted Dec 10, 2002·28 cites·17 claims
- 2480US8866237B2Methods for embedding controlled-cavity MEMS package in integration boardMANACK CHRISTOPHER D·Filed 2012·Granted Oct 21, 2014·6 cites·16 claims
- 2578US4773872AStatic contact member for a high-voltage bushing insertAMERACE CORP·Filed 1987·Granted Sep 27, 1988·39 cites·9 claims
- 2677US10104764B2Electronic device package with vertically integrated capacitorsTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 16, 2018·3 cites·20 claims
- 2776US6943058B2No-flow underfill process and material thereforDELPHI TECH INC·Filed 2003·Granted Sep 13, 2005·24 cites·20 claims
- 2875US6916684B2Wafer-applied underfill processDELPHI TECH INC·Filed 2003·Granted Jul 12, 2005·24 cites·20 claims
- 2973US6811892B2Lead-based solder alloys containing copperDELPHI TECH INC·Filed 2002·Granted Nov 2, 2004·19 cites·20 claims
- 3072US8816513B2Electronic assembly with three dimensional inkjet printed tracesROMIG MATTHEW DAVID·Filed 2012·Granted Aug 26, 2014·4 cites·15 claims
- 3172US6822327B1Flip-chip interconnected with increased current-carrying capabilityDELPHI TECH INC·Filed 2003·Granted Nov 23, 2004·16 cites·20 claims
- 3270US8945986B2Electronic assembly with three dimensional inkjet printed tracesTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 3, 2015·2 cites·7 claims
- 3369US9852979B2Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 26, 2017·1 cites·13 claims
- 3469US7403372B2Multiple fused junction with blown fuse indicationTHOMAS & BETTS INT·Filed 2007·Granted Jul 22, 2008·5 cites·17 claims
- 3569US5903209AEncapsulated fuse with corona shieldTHOMAS & BETTS INT·Filed 1998·Granted May 11, 1999·21 cites·22 claims
- 3665US8847349B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2012·Granted Sep 30, 2014·2 cites·1 claims
- 3759US2025372548A1Inductor module with packaged semiconductor dieTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3857US9321631B2Method for embedding controlled-cavity MEMS package in integration boardTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 26, 2016·0 cites·9 claims
- 3957US4082405ALoadbreak male contact assemblyAMERACE CORP·Filed 1976·Granted Apr 4, 1978·15 cites·10 claims
- 4055US7524202B2Separable electrical connector assemblyTHOMAS & BETTS INT·Filed 2007·Granted Apr 28, 2009·3 cites·14 claims
- 4154US9111845B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 4251US2023326897A1Die backside metallization methods and apparatusWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4349US2015061103A1Embedded die packageTEXAS INSTRUMENTS DEUTSCHLAND·Filed 2013·Application pending·0 cites
- 4446US9899339B2Discrete device mounted on substrateTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 20, 2018·0 cites·9 claims
- 4541US2005046024A1Flip-chip interconnect with increased current-carrying capabilityDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 4640US2007029669A1Integrated circuit with low-stress under-bump metallurgySTEPNIAK FRANK·Filed 2005·Application pending·0 cites
- 4738US2012211884A1Wafer chip scale package connection schemeSTEPNIAK FRANK·Filed 2011·Application pending·0 cites
- 4835US2008157320A1Laterally Interconnected IC Packages and MethodsHARRISON RAY D·Filed 2006·Application pending·0 cites
- 4924US5264107APseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnectionsAT & T BELL LAB·Filed 1991·Granted Nov 23, 1993·4 cites·29 claims
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