Inventor · disambiguated record

Jicun Lu

Also filed as: LU JICUN

1 granted patent·27 citations·filing 2004–2004

43Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0173US7166924B2Electronic packages with dice landed on wire bondsINTEL CORP·Filed 2004·Granted Jan 23, 2007·27 cites·20 claims

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