Inventor · disambiguated record

En-Boa Wu

Also filed as: WU EN-BOA

1 granted patent·30 citations·filing 2000–2000

44Inventor score

Technology areasH10W

Files withIND TECH RES INST1

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1 record

0174US6312974B1Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricatedIND TECH RES INST·Filed 2000·Granted Nov 6, 2001·30 cites·11 claims

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