Inventor · disambiguated record
Sanjeev Sathe
Also filed as: SATHE SANJEEV · SATHE SANJEEV B · SATHE SANJEEV BALWANT
45 granted patents·2 pending applications·1,349 citations·filing 1989–2008
99Inventor score
Files withIBM38ENDICOTT INTERCONNECT TECH INC6CALETKA DAVID VINCENT1INTERNATIONAL BUSINESS MACHIN1UNIV ARIZONA1
Top patents by PatentIndex Score
47 records- 0196US6665187B1Thermally enhanced lid for multichip modulesIBM·Filed 2002·Granted Dec 16, 2003·108 cites·18 claims
- 0294US5926369AVertically integrated multi-chip circuit package with heat-sink supportIBM·Filed 1998·Granted Jul 20, 1999·182 cites·31 claims
- 0392US6627998B1Wafer scale thin film packageIBM·Filed 2000·Granted Sep 30, 2003·58 cites·18 claims
- 0491US7261466B2Imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 28, 2007·16 cites·20 claims
- 0590US6631078B2Electronic package with thermally conductive standoffIBM·Filed 2002·Granted Oct 7, 2003·62 cites·17 claims
- 0689US7510912B2Method of making wirebond electronic package with enhanced chip pad designENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·17 cites·6 claims
- 0789US6061245AFree standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1998·Granted May 9, 2000·91 cites·14 claims
- 0888US7354197B2Imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 8, 2008·10 cites·20 claims
- 0987US6992379B2Electronic package having a thermal stretching layerIBM·Filed 2001·Granted Jan 31, 2006·40 cites·22 claims
- 1086US6622786B1Heat sink structure with pyramidic and base-plate cut-outsIBM·Filed 2002·Granted Sep 23, 2003·45 cites·18 claims
- 1186US6037658AElectronic package with heat transfer meansIBM·Filed 1997·Granted Mar 14, 2000·88 cites·40 claims
- 1285US7510324B2Method of inspecting articles using imaging inspection apparatus with directional coolingENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·9 cites·11 claims
- 1385US7490984B2Method of making an imaging inspection apparatus with improved coolingENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Feb 17, 2009·8 cites·15 claims
- 1484US5786635AElectronic package with compressible heatsink structureIBM·Filed 1996·Granted Jul 28, 1998·54 cites·27 claims
- 1581US7186590B2Thermally enhanced lid for multichip modulesIBM·Filed 2003·Granted Mar 6, 2007·26 cites·20 claims
- 1681US6075287AIntegrated, multi-chip, thermally conductive packaging device and methodologyIBM·Filed 1997·Granted Jun 13, 2000·70 cites·30 claims
- 1781US4977111APorous radiant burners having increased radiant outputUNIV ARIZONA·Filed 1989·Granted Dec 11, 1990·35 cites·4 claims
- 1880US6759270B2Semiconductor chip module and method of manufacture of sameIBM·Filed 2003·Granted Jul 6, 2004·23 cites·8 claims
- 1977US6756662B2Semiconductor chip module and method of manufacture of sameIBM·Filed 2002·Granted Jun 29, 2004·19 cites·10 claims
- 2077US5863814AElectronic package with compressible heatsink structureIBM·Filed 1997·Granted Jan 26, 1999·37 cites·15 claims
- 2175US6245186B1Electronic package with compressible heatsink structureIBM·Filed 1999·Granted Jun 12, 2001·33 cites·12 claims
- 2271US5754400ADemountable heat sinkIBM·Filed 1997·Granted May 19, 1998·34 cites·6 claims
- 2368US6747331B2Method and packaging structure for optimizing warpage of flip chip organic packagesIBM·Filed 2002·Granted Jun 8, 2004·13 cites·5 claims
- 2466US5912800AElectronic packages and method to enhance the passive thermal management of electronic packagesIBM·Filed 1997·Granted Jun 15, 1999·32 cites·16 claims
- 2563US7253518B2Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 7, 2007·2 cites·13 claims
- 2663US6255136B1Method of making electronic package with compressible heatsink structureIBM·Filed 1999·Granted Jul 3, 2001·20 cites·15 claims
- 2762US6788859B1Laminate substrate containing fiber optic cablesIBM·Filed 2002·Granted Sep 7, 2004·7 cites·16 claims
- 2862US5604445AApparatus, and corresponding method, for stress testing semiconductor chipsIBM·Filed 1994·Granted Feb 18, 1997·22 cites·30 claims
- 2961US6256203B1Free standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1999·Granted Jul 3, 2001·22 cites·20 claims
- 3061US5673177AHeat sink structure with corrugated wound wire heat conductive elementsIBM·Filed 1995·Granted Sep 30, 1997·27 cites·61 claims
- 3158US5966290AElectronic packages and a method to improve thermal performance of electronic packagesINTERNATIONAL BUSINESS MACHIN·Filed 1997·Granted Oct 12, 1999·23 cites·6 claims
- 3258US5654876ADemountable heat sinkIBM·Filed 1996·Granted Aug 5, 1997·20 cites·13 claims
- 3355US6347901B1Solder interconnect techniquesIBM·Filed 1999·Granted Feb 19, 2002·20 cites·2 claims
- 3454US6967389B2Wafer with semiconductor chips mounted thereonIBM·Filed 2003·Granted Nov 22, 2005·4 cites·5 claims
- 3554US6731012B1Non-planar surface for semiconductor chipsIBM·Filed 1999·Granted May 4, 2004·15 cites·17 claims
- 3653US6219234B1Method for using pulsating flow to improve thermal transport in systemsIBM·Filed 1999·Granted Apr 17, 2001·11 cites·26 claims
- 3751US2008119029A1Wafer scale thin film packageCALETKA DAVID VINCENT·Filed 2008·Application pending·0 cites
- 3850US7348261B2Wafer scale thin film packageIBM·Filed 2003·Granted Mar 25, 2008·3 cites·6 claims
- 3950US6058015AElectronic packages and a method to improve thermal performance of electronic packagesIBM·Filed 1999·Granted May 2, 2000·13 cites·6 claims
- 4049US7026706B2Method and packaging structure for optimizing warpage of flip chip organic packagesIBM·Filed 2004·Granted Apr 11, 2006·3 cites·10 claims
- 4148US7037753B2Non-planar surface for semiconductor chipsIBM·Filed 2004·Granted May 2, 2006·2 cites·18 claims
- 4248US5914857AAir flow devices for electronic boardsIBM·Filed 1998·Granted Jun 22, 1999·12 cites·3 claims
- 4346US6291776B1Thermal deformation management for chip carriersIBM·Filed 1998·Granted Sep 18, 2001·13 cites·12 claims
- 4446US2008029888A1Solder Interconnect Joints For A Semiconductor PackageIBM·Filed 2006·Application pending·0 cites
- 4540US6989607B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriersIBM·Filed 2003·Granted Jan 24, 2006·0 cites·12 claims
- 4639US6639302B2Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carriesIBM·Filed 2002·Granted Oct 28, 2003·0 cites·25 claims
- 4737US7183642B2Electronic package with thermally-enhanced lidIBM·Filed 2002·Granted Feb 27, 2007·0 cites·9 claims
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