Inventor · disambiguated record
Yuichi Inada
Also filed as: INADA YUICHI
1 granted patent·10 pending applications·8 citations·filing 2003–2024
30Inventor score
Top patents by PatentIndex Score
11 records- 0149US2024335994A1Management device for injection molding machine, injection molding machine, and management method for injection molding machineSUMITOMO HEAVY INDUSTRIES·Filed 2024·Application pending·0 cites
- 0249US2024335997A1Injection molding machineSUMITOMO HEAVY INDUSTRIES·Filed 2024·Application pending·0 cites
- 0349US2024335993A1Controller for injection molding machine, injection molding machine, and control method for injection molding machineSUMITOMO HEAVY INDUSTRIES·Filed 2024·Application pending·0 cites
- 0449US2024335992A1Management device for injection molding machine, injection molding machine, and management method for injection molding machineSUMITOMO HEAVY INDUSTRIES·Filed 2024·Application pending·0 cites
- 0542US7270535B2Disc-molding mold, molded product, molding machine and disk-shaped memberSEIKO GIKEN KK·Filed 2004·Granted Sep 18, 2007·8 cites·11 claims
- 0638US2009074904A1Mold for forming disc, method for manufacture same, and mold partsGOTO YOSHIYUKI·Filed 2006·Application pending·0 cites
- 0737US2006051552A1Molding die,molding method, disc substrate, and molding machineSEIKO GIKEN KK·Filed 2003·Application pending·0 cites
- 0836US2007275115A1Mold For Molding Disk, Mirror-Surface Disk, And Molded ProductSEIKO GIKEN KK·Filed 2005·Application pending·0 cites
- 0936US2005220928A1Mold apparatus, molded product, method of molding the same, and molding machineINADA YUICHI·Filed 2004·Application pending·0 cites
- 1033US2009117315A1Disc-molding mold, mirror-surface disc, and method for producing mold for disc moldingSEIKO GIKEN KK·Filed 2006·Application pending·0 cites
- 1133US2012302697A1Coating composition, coated article, and process for formation of multilayer coating filmINADA YUICHI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →