Inventor · disambiguated record
Kok Yeow Lim
Also filed as: LIM KOK YEOW · LIM KOK YEOW E · LIM KOK YEOW EDDY
6 granted patents·3 pending applications·16 citations·filing 2003–2021
74Inventor score
Files withMANUFACTURING INTEGRATION TECH LTD2ADVANCED SYSTEMS AUTOMATION1ADVANPACK SOLUTION PTES LTD1ADVANPACK SOLUTIONS PTE LTD1GENERIC POWER PTE LTD1
Top patents by PatentIndex Score
9 records- 0181US9929036B2System and method for peeling a semiconductor chip from a tape using a multistage ejectorMANUFACTURING INTEGRATION TECH LTD·Filed 2015·Granted Mar 27, 2018·7 cites·11 claims
- 0263US10699923B2Transfer system for flipping and multiple checking of electronic devicesMIT SEMICONDUCTOR PTE LTD·Filed 2016·Granted Jun 30, 2020·2 cites·9 claims
- 0353US7692440B2Handler for semiconductor singulation and method thereforADVANCED SYSTEMS AUTOMATION·Filed 2003·Granted Apr 6, 2010·7 cites·29 claims
- 0449US10403782B2Laser scribing of thin-film solar cell panelMANUFACTURING INTEGRATION TECH LTD·Filed 2017·Granted Sep 3, 2019·0 cites·11 claims
- 0548US2012181259A1Laser Scribing Of Thin-Film Solar Cell PanelKWONG KIM MONE·Filed 2009·Application pending·0 cites
- 0641US2008150107A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTION PTES LTD·Filed 2008·Application pending·0 cites
- 0738US12512348B2System and process for sorting die from wafer using angled wafer table and angled turretMIT SEMICONDUCTOR TIAN JIN CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·12 claims
- 0838US2007196979A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 0926US10715790B2System and method for lead foot angle inspection using multiview stereo visionGENERIC POWER PTE LTD·Filed 2017·Granted Jul 14, 2020·0 cites·4 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →