Inventor · disambiguated record
Shih-Yen Chen
Also filed as: CHEN SHIH-YEN
13 granted patents·5 pending applications·45 citations·filing 2002–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10FONG YEN ELECTRICAL CO LTD1HO TENG-HSIANG1KAO YU HSIN INTERNATION CO LED1LIN MING-JU1
Top patents by PatentIndex Score
18 records- 0191US12009337B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0284US8761388B2Electronic device case with water resistant side buttonUNIVERSAL SCIENT IND SHANGHAI·Filed 2013·Granted Jun 24, 2014·17 cites·10 claims
- 0383US2025357418A1Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0480US12438118B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0579US2024297138A1Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0675US11984419B2Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0775US8867201B2Composite stylus retaining structure in electronic deviceLIN MING-JU·Filed 2012·Granted Oct 21, 2014·9 cites·19 claims
- 0868US11469203B2Method for forming package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 0959US2016065122A1Expandable sticking solar cell apparatus and power supply thereofKAO YU HSIN INTERNATION CO LED·Filed 2014·Application pending·0 cites
- 1058US10811377B2Package structure with a barrier layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1155US6749181B1HumidifierFONG YEN ELECTRICAL CO LTD·Filed 2002·Granted Jun 15, 2004·10 cites·4 claims
- 1253US6569695B1Method for monitoring particles and defects on wafer surface and in processMACRONIX INT CO LTD·Filed 2002·Granted May 27, 2003·7 cites·14 claims
- 1353US2023411325A1Chip package integration with hybrid bondingXILINX INC·Filed 2022·Application pending·0 cites
- 1450US11000923B2Tool and method of reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 11, 2021·0 cites·20 claims
- 1548US9808891B2Tool and method of reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·0 cites·15 claims
- 1645US9112073B2Photo detectorUNIV NAT TAIWAN·Filed 2014·Granted Aug 18, 2015·0 cites·42 claims
- 1744US2013181443A1Rapid leakage-proof structure for tubesHO TENG-HSIANG·Filed 2012·Application pending·0 cites
- 1839US10861761B2Semiconductor packaged wafer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →