Inventor · disambiguated record

Kouji Hirotani

Also filed as: HIROTANI KOUJI

2 granted patents·8 citations·filing 1997–2001

50Inventor score

Technology areasH10W

Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD2

Top patents by PatentIndex Score

2 records

0140US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
0238US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims

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