Inventor · disambiguated record
Li Deng
Also filed as: DENG LI · DENG LI-BING
6 granted patents·3 pending applications·13 citations·filing 2007–2020
77Inventor score
Top patents by PatentIndex Score
9 records- 0190US10991679B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Apr 27, 2021·2 cites·20 claims
- 0289US10930622B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·21 claims
- 0378US11538746B2Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making sameINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 0478US10770434B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Sep 8, 2020·2 cites·21 claims
- 0578US10727208B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Jul 28, 2020·2 cites·25 claims
- 0673US7587976B2Printing apparatus having fixing mechanism including air pipe assemblySHENZHEN FUTAIHONG PREC IND CO·Filed 2007·Granted Sep 15, 2009·2 cites·8 claims
- 0746US2016324487A1Wearable Personal Computer and Healthcare DevicesINTEL CORP·Filed 2014·Application pending·0 cites
- 0839US2020366514A1Network Secure Admission Method and Home Network DeviceHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
- 0936US2019355700A1Techniques for windowed substrate integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
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