Inventor · disambiguated record
Takeshi Onogami
Also filed as: ONOGAMI TAKESHI
1 granted patent·3 pending applications·2 citations·filing 2014–2019
19Inventor score
Files withTEXAS INSTRUMENTS INC4
Top patents by PatentIndex Score
4 records- 0174US10879144B2Semiconductor package with multilayer moldTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 29, 2020·2 cites·17 claims
- 0250US2015147845A1Dual sided embedded die and fabrication of same backgroundTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 0343US2016240392A1Dual sided embedded die and fabrication of same backgroundTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 0442US2015008566A1Method and structure of panelized packaging of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
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