Inventor · disambiguated record
Seong Hun Na
Also filed as: NA SEONG HUN
10 granted patents·4 pending applications·23 citations·filing 2016–2024
84Inventor score
Files withSAMSUNG ELECTRO MECH14
Top patents by PatentIndex Score
14 records- 0191US11277113B2Bulk-acoustic wave resonatorSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 15, 2022·3 cites·15 claims
- 0289US11437563B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 6, 2022·6 cites·15 claims
- 0387US10483618B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 19, 2019·5 cites·14 claims
- 0485US10164602B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 25, 2018·5 cites·16 claims
- 0578US11171096B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 9, 2021·2 cites·18 claims
- 0675US10715100B2Acoustic wave filter device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 14, 2020·2 cites·19 claims
- 0757US2025089165A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0856US2024128136A1Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0953US11177789B2Acoustic wave device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 16, 2021·0 cites·21 claims
- 1051US10903816B2Thin-film type packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 26, 2021·0 cites·19 claims
- 1151US10432170B2Acoustic wave filter deviceSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 1, 2019·0 cites·18 claims
- 1250US2023179170A1Acoustic wave resonator packageSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 1349US11476832B2Bulk-acoustic resonator moduleSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 1447US2022200565A1Bulk-acoustic wave resonator packageSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →