Inventor · disambiguated record
Tadashi Arikawa
Also filed as: ARIKAWA TADASHI
9 granted patents·1 pending application·140 citations·filing 1993–2019
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0177US5493153APlastic-packaged semiconductor device having a heat sink matched with a plastic packageTOKYO TUNGSTEN KK·Filed 1993·Granted Feb 20, 1996·59 cites·38 claims
- 0273US6475429B2Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Nov 5, 2002·19 cites·19 claims
- 0368US6271585B1Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 1998·Granted Aug 7, 2001·32 cites·27 claims
- 0458US7083759B2Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2001·Granted Aug 1, 2006·10 cites·7 claims
- 0555US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 0654US10215512B2Heat spreader and method for manufacturing the sameALMT CORP·Filed 2015·Granted Feb 26, 2019·1 cites·6 claims
- 0749US11380602B2Plating film and plated memberSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Jul 5, 2022·0 cites·5 claims
- 0847US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
- 0939US2006246314A1Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directionsALMT CORP·Filed 2006·Application pending·0 cites
- 1036US7547412B2Composite material, method for producing same and member using sameALMT CORP·Filed 2003·Granted Jun 16, 2009·0 cites·7 claims
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