Inventor · disambiguated record
Hui-Jung Tsai
Also filed as: TSAI HUI-JUNG
78 granted patents·17 pending applications·217 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD90CHENG MING-DA2HENGHAO TECH CO LTD1HWANG CHIEN LING1TSAI HUI-JUNG1
Top patents by PatentIndex Score
95 records- 0199US11651994B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·5 cites·20 claims
- 0298US11508633B2Package structure having taper-shaped conductive pillar and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·7 cites·20 claims
- 0398US10622321B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·48 cites·20 claims
- 0497US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
- 0597US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
- 0697US10361122B1Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·14 cites·20 claims
- 0796US11996381B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·2 cites·20 claims
- 0896US11990383B2Package structure having at least one die with a plurality of taper-shaped die connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·2 cites·20 claims
- 0996US11789366B2Method for removing resist layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 1096US9018758B2Cu pillar bump with non-metal sidewall spacer and metal top capHWANG CHIEN LING·Filed 2010·Granted Apr 28, 2015·28 cites·20 claims
- 1195US10964591B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·7 cites·20 claims
- 1294US10515848B1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·9 cites·20 claims
- 1393US11557561B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·2 cites·20 claims
- 1493US10707094B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 1593US10340206B2Dense redistribution layers in semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 2, 2019·6 cites·20 claims
- 1693US10276402B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·8 cites·19 claims
- 1792US11378886B2Method for removing resist layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 1892US10629540B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 1992US2025364271A1Dense redistribution layers in semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2092US2025364340A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2191US11515276B2Integrated circuit, package structure, and manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 2291US11404308B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 2389US11646281B2Semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 9, 2023·2 cites·20 claims
- 2489US11417604B2Dense redistribution layers in semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 16, 2022·3 cites·20 claims
- 2589US9685372B2Method of forming Cu pillar bump with non-metal sidewall spacer and metal top capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 20, 2017·6 cites·20 claims
- 2689US2025349639A1Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2788US11450641B2Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·20 claims
- 2888US10879199B2Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·4 cites·20 claims
- 2987US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 3086US12469757B2Package structure including a die having a taper-shaped die connectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 3186US12362309B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3286US10879161B2Semiconductor packages having a seed layer structure protruding from an edge of metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·6 cites·20 claims
- 3386US10840129B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
- 3486US10186462B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·4 cites·21 claims
- 3584US12020983B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 3684US2025060676A1Method for removing resistor layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3783US12164232B2Method for removing resistor layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3883US11088068B2Semiconductor packages and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·3 cites·20 claims
- 3982US12431400B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 4082US2024304542A1Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4181US12315819B2Method of forming RDLs and structure formed thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 4281US12302677B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4381US12021026B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 4481US10854570B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·2 cites·20 claims
- 4580US12469718B2Dense redistribution layers in semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 4680US12040283B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 4780US11488908B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·2 cites·20 claims
- 4880US11158775B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 26, 2021·3 cites·20 claims
- 4980US10522501B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 5080US2025029946A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 95 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →