Inventor · disambiguated record
Kwangbok Woo
Also filed as: WOO KWANGBOK
2 granted patents·2 pending applications·0 citations·filing 2021–2025
25Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0174US2025372500A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0262US12406917B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 0358US2025176104A1Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0448US11749592B2Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →