Inventor · disambiguated record
Neal Bowen
Also filed as: BOWEN NEAL · BOWEN NEAL M
4 granted patents·41 citations·filing 2001–2014
75Inventor score
Files withMICRON TECHNOLOGY INC4
Top patents by PatentIndex Score
4 records- 0178US9716023B2Methods for temporarily bonding a device wafer to a carrier wafer, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 25, 2017·4 cites·18 claims
- 0275US7021520B2Stacked chip connection using stand off stitch bondingMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 4, 2006·28 cites·40 claims
- 0368US7372129B2Two die semiconductor assembly and system including sameMICRON TECHNOLOGY INC·Filed 2005·Granted May 13, 2008·5 cites·34 claims
- 0447US7368320B2Method of fabricating a two die semiconductor assemblyMICRON TECHNOLOGY INC·Filed 2003·Granted May 6, 2008·4 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →